Nanoscopic microcavities offer control in light filtering
11 February, 2013Using the geometric and material properties of a unique nanostructure, Boston College researchers have uncovered a novel photonic effect where surface plasmons interact with light to form ‘plasmonic halos’ of selectable output colour.
ams AS3953 NFiC interface chip
05 February, 2013The ams AS3953 interface chip offers a high data-rate interface between an NFC device such as a smartphone and any host microcontroller with a standard serial peripheral interface (SPI).
FTDI FT313H host controller IC
01 February, 2013 | Supplied by: Glyn LtdThe FT313H host controller IC supports USB 2.0 high-speed (480 Mbps), full-speed (12 Mbps) and low-speed (1.5 Mbps) implementations. Designed for easy integration, it adds high-speed connectivity capability into a system through its support of standard USB class drivers.
NXP Semiconductors NextPower Live power MOSFETs for hot-swap applications
24 January, 2013 | Supplied by: NXP Semiconductors (Australia & New Zealand)NXP Semiconductors’ NextPower Live family of linear mode Power MOSFETs is designed specifically for use in hot-swap environments. The family offers both good linear mode performance and a low RDS(on) value.
International Rectifier IR3230SPbF gate drive IC simplifies eBike design
16 January, 2013 | Supplied by: Future ElectronicsInternational Rectifier has introduced the IR3230SPbF three-phase gate drive IC for e-bike inverters, providing efficient electric mobility.
Emerson Network Power ATCA-7470 40G ATCA blade
14 January, 2013 | Supplied by: Vertiv Australia Pty LtdThe latest 40G AdvancedTCA (ATCA) packet processing blade from Emerson Network Power - the ATCA-7470 - is designed to utilise the full capabilities of the Intel platform for communications infrastructure, formerly codenamed Crystal Forest, with an optimised balance of processing, memory, I/O, data movement and interfaces.
3D CAD model selection microsite
11 January, 2013 | Supplied by: RSRS Components’ 3D CAD microsite adds the capability to locate, view and download models by product type and manufacturer.
Banner Engineering Online Tower Light Configurator
11 January, 2013 | Supplied by: Micromax Pty LtdThe Banner Engineering tower light configurator is an online tool that allows users to customise tower light selections and view related information. The tool was designed for a variety of operating systems including iPad and Android tablets.
New 2D material for next-generation, high-speed electronics
11 January, 2013Australian scientists have produced a new two-dimensional material that could revolutionise the electronics market, making ‘nano’ more than just a marketing term. Made of layers of molybdenum oxides crystals, the new material has unique properties that encourage the free flow of electrons at ultrahigh speeds and overcomes the limitations of graphene.
Microchip Technology MGC3130 e-field-based, configurable 3D gesture controller
10 January, 2013 | Supplied by: Microchip Technology AustraliaMGC3130 is an e-field-based, configurable 3D gesture controller that includes a library of gestures and is claimed to provide precise hand position tracking.
congatec reference board for video wall system design
10 January, 2013 | Supplied by: Congatec Australia Pty LtdVideo wall systems increasingly rely on high-quality videos and (3D) graphics and therefore require a maximum number of graphics interfaces. The congatec reference board offers up to nine independent DisplayPort connectors in combination with an MXM graphics module and a COM Express CPU module.
Gresham Power low-profile 600 W power supplies
09 January, 2013 | Supplied by: Gresham Power ElectronicsGresham Power Electronics has announced the availability of its eFO600 range of 600 W, low-profile, high power density power supplies.
element14 Dev Kit HQ
09 January, 2013 | Supplied by: element14element14 has expanded its Dev Kit HQ with a ‘quick find’ online product selector designed to help engineers source the latest products available by manufacturer and technology application.
Extension of operation temperature range to 200°C enabled by Al/Cu wire bonds
19 December, 2012 | Supplied by: Semikron DanfossThe demand for an extension of the operation temperature range to 200°C has been promoted by several trends.
Boosting heat transfer with nanoglue
13 December, 2012A team of interdisciplinary researchers at Rensselaer Polytechnic Institute has developed a new method for significantly increasing the heat transfer rate across two different materials. Results of the team’s study could enable new advances in cooling computer chips and lighting-emitting diode (LED) devices, collecting solar power, harvesting waste heat and other applications.
