Latest Articles

Reducing PCB assembly lead times without increasing risk

How subcontract manufacturers can reduce PCB assembly lead times through better documentation, component planning and cross-functional collaboration.

Assembly 01 March, 2026

Safeguard pocket electronics with smart compact enclosures

Considering ergonomics, functionality, size, weight, durability and aesthetics when selecting enclosures for pocket-sized devices.

Assembly 01 March, 2026

Turning peanut waste into graphene for next-gen electronics

UNSW Sydney engineers have developed a cheaper and greener way to make graphene from leftover peanut shells.

Design 26 February, 2026

Diamond thermal management for high-power electronics

Researchers have unveiled a scalable method to grow patterned diamond films directly on wafers, cutting device temperatures and boosting reliability.

Assembly 26 February, 2026

What does 'flexibility' actually look like?

Researchers have published a study that provides experimental evidence linking the mechanical stiffness of organic semiconductor films to their electronic performance.

Components 25 February, 2026

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Business
Avoiding EMC issues: simple tests you can do yourself

Avoiding EMC issues: simple tests you can do yourself

This is a brief overview of EMC compliance with some practical tips on not getting caught out.

Article 02 May, 2025
Components
What does 'flexibility' actually look like?

What does 'flexibility' actually look like?

Researchers have published a study that provides experimental evidence linking the mechanical stiffness of organic semiconductor films to their...

Article 25 February, 2026
Data acquisition
Wireless innovation transmits vast amounts of data

Wireless innovation transmits vast amounts of data

Researchers have developed a machine-learning system that curves ultrahigh-frequency signals around obstacles, solving a barrier to sub-terahertz...

Article 21 August, 2025
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