Novel antenna tech developed for 6G communications
18 December, 2024Researchers have developed a novel metasurface antenna that can generate and control multiple frequency components through software.
u-blox MAYA-W4 tri-radio module
12 December, 2024 | Supplied by: u-blox Singapore Pte LtdThe u-blox MAYA-W4 tri-radio module is suitable for a range of IoT applications in diverse industries, as it enhances device connectivity and interoperability.
3D-printed, shape-shifting antenna inspired by sci-fi
12 December, 2024 by Ajai Raj, Johns Hopkins Applied Physics LaboratoryResearchers at the Johns Hopkins Applied Physics Laboratory in Laurel, Maryland, have created an antenna that can change its shape based on its temperature.
Researchers knit 'blanket' of radio-frequency antennas
05 December, 2024 by Jane Nisselson, Columbia EngineeringResearchers have used traditional flat-knitting techniques to fabricate flexible and lightweight large-aperture antennas.
Quectel YEMD302L1A GNSS combo antenna
03 December, 2024 | Supplied by: QuectelThe Quectel YEMD302L1A GNSS combo antenna supports a broad frequency range for 4G coverage, including 700–960 MHz and 1710–2690 MHz bands.
Eliminating 'efficiency droop' for brighter LEDs
29 November, 2024Researchers have found a way to make LEDs brighter while maintaining their efficiency for applications such as visible light communication.
ADLINK EMP-100 fanless mini PC
13 November, 2024 | Supplied by: ADLINK Technology IncThe ADLINK EMP-100 fanless mini PC is an effective digital signage player, suitable for retail spaces, restaurants, shopping centres and manufacturing facilities.
Axiomtek CEM710 COM Express Type 7 module
12 November, 2024 | Supplied by: TekdisThe Axiomtek CEM710 COM Express Type 7 module is suitable for embedded edge AI servers, high-end network testers, network traffic probes and rugged edge applications.
Unlocking next-gen chip efficiency
07 November, 2024 by University of Virginia School of Engineering and Applied ScienceBy studying how heat moves through ultra-thin metal layers, researchers have provided a foundation for designing smaller, faster and cooler electronic devices.
STMicroelectronics Page EEPROM two-in-one memory
06 November, 2024 | Supplied by: STMicroelectronics Pty LtdThe STMicroelectronics Page EEPROM two-in-one memory is suitable for applications such as healthcare devices, asset trackers and e-bikes, as well as other industrial and consumer products.
Quectel EG91-EX LTE Cat 1 module
06 November, 2024 | Supplied by: QuectelThe Quectel EG91-EX LTE Cat 1 module is optimised for M2M and IoT applications, and offers data rates of up to 10 Mbps for downlink and 5 Mbps for uplink.
Quectel BG770A-SN satellite communication module
05 November, 2024 | Supplied by: QuectelThe Quectel BG770A-SN satellite communication module is suitable for a range of applications including transportation, energy, maritime, heavy industry and agriculture.
KYOCERA AVX WBR Series microwave chip resistors
05 November, 2024 | Supplied by: Richardson RFPDThe KYOCERA AVX WBR Series of microwave chip resistors are designed to provide ultra-stable performance in applications that require thermos compression, epoxy or ultrasonic attachment.
STMicroelectronics STSAFE-TPM trusted platform modules
31 October, 2024 | Supplied by: STMicroelectronics Pty LtdSTMicroelectronics' range of STSAFE-TPM trusted platform modules is designed to provide cryptographic asset protection to meet security and regulatory requirements for critical information systems.
3D semiconductor chip alignment boosts performance
31 October, 2024 by University of Massachusetts AmherstResearchers have developed an ultra-precise method to align 3D semiconductor chips using lasers and holograms.
