Assembly

Manufacturable chipset developed for quantum computing

06 March, 2025

Twenty years since the first photonic qubit breakthroughs, PsiQuantum has unveiled mass-manufacturable chips for utility-scale, million-qubit quantum computers.


Hammond IP68 1550ZF flanged die-cast aluminium enclosures

01 March, 2025 | Supplied by: Hammond Electronics Pty Ltd

Hammond has introduced the IP68 1550ZF range, flanged versions of all 18 sizes in the 1550Z die-cast enclosure family.


Wearable biosensors enable real-time health monitoring

25 February, 2025 by Kimm Fesenmaier, Caltech

Researchers have developed wearable sensors that can track health biomarkers non-invasively using inkjet-printed nanoparticles.


Proximity effect shows potential for more efficient electronics

12 February, 2025 by Matthew Carroll, Pennsylvania State University

Researchers have shown that a non-ferroelectric material can acquire ferroelectric properties through interfacing with a ferroelectric material, a phenomenon known as proximity-induced ferroelectricity.


Smarter quantum computers with dual-code error correction

05 February, 2025 by University of Innsbruck

Researchers have developed a method with which a quantum computer can switch back and forth between two correction codes and thus perform all computing operations protected against errors.


Harnessing electromagnetic waves to improve wireless communication

04 February, 2025 by Paul Logothetis, University of Ottawa

Researchers have enhanced the frequency conversion of terahertz waves in graphene-based structures, thereby unlocking the potential for faster wireless communication.


Neuromorphic semiconductor chip corrects errors autonomously

03 February, 2025 by Korea Advanced Institute of Science and Technology

Researchers have developed a computing chip that can learn, correct errors and process AI tasks.


OKW Gehäusesysteme solid-box advanced enclosures

01 February, 2025 | Supplied by: ROLEC OKW Australia New Zealand P/L

OKW Gehäusesysteme offers a range of solid-box advanced enclosures that are suitable for mounting arm systems in medical technology.


New optical memory platform for faster calculations

28 January, 2025 by James Badham, UC Santa Barbara

Researchers have developed an optical memory platform that leverages light to perform calculations at higher speeds than traditional electronics.


Researchers leverage AI for wireless chip design

27 January, 2025 by John Sullivan, Princeton Engineering

Researchers from Princeton University have used deep learning to create faster, high-performance wireless chip designs.


New properties discovered in diamond semiconductors

22 January, 2025 by University of Illinois Urbana-Champaign

Researchers have discovered plasmons in boron-doped diamonds, paving the way for advanced quantum devices, biosensors and solar technology.


Scalable aluminium surface method enhances electronic cooling

22 January, 2025 by Alexandra Becker, Rice University

Engineers have developed a new way to create specially patterned aluminium surfaces that could enhance electronic cooling systems.


Researchers create quantum 'Schrödinger's cat' in silicon chip

21 January, 2025 by UNSW Sydney

Researchers have brought a famous quantum thought experiment, ‘Schrödinger’s cat,’ to life inside a silicon chip, offering new insights into quantum error correction.


Hammond Electronics IP68 1550ZF die-cast aluminium enclosures

21 January, 2025 | Supplied by: Hammond Electronics Pty Ltd

The 1550ZF range of die-cast aluminium enclosures feature a tongue and groove design and a pre-formed one-piece silicone rubber gasket, for IP68 environmental protection.


Quantum teleportation performed over busy internet cables

09 January, 2025 by Amanda Morris, Northwestern University

Northwestern engineers have demonstrated quantum teleportation over a fibre-optic cable carrying internet traffic, introducing the new possibility of combining quantum communication with existing internet cables.


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