Thinner materials for more compact quantum computing devices
17 October, 2024Researchers from NTU Singapore have used very thin materials to produce entangled pairs of photons that can be used as quantum bits for computing.
Atomic-level mechanism discovered for polycrystalline materials
11 October, 2024Researchers have captured atomic-level observations of grain rotation in polycrystalline materials; their research findings could help develop more efficient electronics.
Liquid immersion cooling system launched in Hong Kong
10 October, 2024The Hong Kong University of Science and Technology has launched an immersion cooling system to enhance the capacity of high-performance computing devices while reducing energy consumption.
Nature and plastics inspire breakthrough in soft sustainable materials
10 October, 2024 by Amanda Morris, Northwestern UniversityBiodegradable structures could revolutionize energy, information technologies and advanced medicine.
Quantum computing experts conquer entanglement challenge in silicon chips
03 October, 2024 by University of New South WalesResearchers have demonstrated the quantum entanglement of two electrons, each bound to a different atom of phosphorus, placed inside a silicon quantum computer chip.
Overcoming magnetic disorder in quantum insulators
12 September, 2024 by Monash UniversityA Monash-led team has demonstrated that the breakdown in topological protection in quantum insulators is caused by magnetic disorder.
Silicon chip enhances 6G communications
06 September, 2024A team of scientists has unlocked the potential of 6G communications with a new polarisation multiplexer.
TTM Technologies XMWT80L1G RF termination
05 September, 2024 | Supplied by: Richardson RFPDThe TTM Technologies XMWT80L1G RF termination is designed to replace larger, bulkier caseless and connectorised terminations.
Electric reactor could cut industrial emissions
05 September, 2024 by Laura Castañón, Stanford UniversityResearchers at Stanford Engineering have developed a new thermochemical reactor that can generate the immense heat needed for industrial processes using electricity instead of fossil fuels.
STMicroelectronics X-CUBE-TCPP software pack
01 September, 2024 | Supplied by: STMicroelectronics Pty LtdThe STMicroelectronics X-CUBE-TCPP software pack is designed to to simplify product designs by leveraging the USB Power Delivery specification.
An entire brain–machine interface on a chip
29 August, 2024 by Michael David Mitchell, EPFLResearchers from EPFL have developed a next-generation miniaturised brain–machine interface capable of direct brain-to-text communication on tiny silicon chips.
Computer chips have the potential to become even smaller
22 August, 2024 by Werner Siefer, Paul Scherrer InstituteResearchers at the Paul Scherrer Institute have been improving the resolution of a process known as photolithography, in order to help advance the miniaturisation of computer chips.
Smart fabric powers self-sustaining electronics
22 August, 2024 by University of WaterlooResearchers have developed a smart fabric based on MXene and conductive polymers that can convert body heat and solar energy into electricity.
Lithium extraction breakthrough: a step towards a greener future
15 August, 2024Researchers have developed a cheaper and more efficient method of lithium extraction than conventional water-based methods.
VECOW IVX-1000 in-vehicle computing workstation
12 August, 2024 | Supplied by: Backplane Systems Technology Pty LtdThe VECOW IVX-1000 in-vehicle computing workstation is designed to meet the needs of the mining industry, with software ignition power control and optional UPS support.
