[White paper] COM-HPC Mini — a game changer in the electronics space

Supplied by Congatec on Wednesday, 20 November, 2024


The COM-HPC specification 1.2 is now ratified, introducing COM-HPC Mini to the market. First modules based on this spec are available. Since modules alone don't provide OEMs with the agility to optimize and expand their solutions, a next-gen COM-HPC ecosystem was created, helping developers of ultra-compact high-performance systems solve the challenge of fitting high performance into a mini footprint.

Learn how the COM-HPD mini module is set to revolutionize electronic manufacturing. Discover how to harness this latest technology to enhance your electronic products.


Related White Papers

Smart metering for electronic design engineers

After years of being relatively static, the climate is now ripe for innovation in the area of...

Augmented reality now solving real-life problems — an eBook

Imagine being able to see inside a patient rather than viewing scans or X-rays. Imagine being...

SiC in power electronics

The total market of SiC power devices is predicted to rise to more than US$1 billion by...


  • All content Copyright © 2025 Westwick-Farrow Pty Ltd