[White paper] COM-HPC Mini — a game changer in the electronics space

Supplied by Congatec on Wednesday, 20 November, 2024


The COM-HPC specification 1.2 is now ratified, introducing COM-HPC Mini to the market. First modules based on this spec are available. Since modules alone don't provide OEMs with the agility to optimize and expand their solutions, a next-gen COM-HPC ecosystem was created, helping developers of ultra-compact high-performance systems solve the challenge of fitting high performance into a mini footprint.

Learn how the COM-HPD mini module is set to revolutionize electronic manufacturing. Discover how to harness this latest technology to enhance your electronic products.


Related White Papers

How to safeguard your system from humidity and condensation

Humidity and condensation within your system can lead to power failures of catastrophic...

How to design rapid-start power applications that never fail

Learn how to design an isolated power system that can start up within 10 ms of application of...

Which is better to protect your PCB — coating or resin?

The design of the PCB, the housing and the anticipated end-use environment all play a major...


  • All content Copyright © 2026 Westwick-Farrow Pty Ltd