ADLINK COM-Express Type 7 module
14 December, 2023 | Supplied by: ADLINK Technology IncThe ADLINK COM-Express Type 7 module functions as a go-to solution for various mission-critical data processing and networking applications at 15 W, 45 W TDP.
Quectel SG520B smart modules
13 December, 2023 | Supplied by: QuectelThe Quectel SG520B smart modules feature a built-in Android operating system and are based on the Qualcomm QCM4490 processor from Qualcomm Technologies, Inc.
STMicroelectronics STM32WB09 wireless microcontroller
13 December, 2023 | Supplied by: STMicroelectronics Pty LtdThe STM32WB09 wireless microcontroller supports advanced Bluetooth 5.3 capabilities including direction and distance finding for position detection.
congatec COM Express Computer-on-Modules
12 December, 2023 | Supplied by: Congatec Australia Pty LtdThe COM Express Computer-on-Modules from congatec are designed to provide full compliance for shock- and vibration-resistant operation in harsh environments.
Solid-state thermal transistor for better heat management
05 December, 2023Researchers have developed a solid-state thermal transistor that leverages an electric field to control the movement of heat within a semiconductor device.
Novel antenna for high-security 6G communications
05 December, 2023Researchers have developed a new antenna system that leverages space-time coding technology to enhance security for 6G wireless communications.
Erntec IEP3 integrated magnetic encoder series
01 December, 2023 | Supplied by: ERNTEC Pty LtdThe Erntec IEP3 series of integrated magnetic encoders are suitable for a range of applications and are characterised by high accuracy in small installation spaces.
Microchip Technology PIC18-Q20 microcontrollers
01 December, 2023 | Supplied by: Microchip Technology Hong Kong LimitedThe PIC18-Q20 microcontrollers from Microchip Technology are suitable for real-time control, touch sensing and connectivity applications.
Diamond device for next-gen semiconductors
29 November, 2023 by Amber Rose, University of Illinois Urbana-ChampaignResearchers at the University of Illinois Urbana-Champaign have developed a semiconductor device made using diamond that has a high breakdown voltage and low leakage current.
New technique boosts fibre laser power
22 November, 2023A team of researchers have increased the power of fibre lasers without sacrificing beam quality, offering potential in counterdrone and other technologies.
High-performance, ultra-fast lasers that fit on a fingertip
15 November, 2023Researchers have developed a chip-scale mode-locked laser that could enable pocket-sized devices to perform medical imaging, food safety inspection and more.
BeagleBoard BeagleV-Fire SBC
15 November, 2023 | Supplied by: element14The BeagleBoard BeagleV-Fire SBC is suitable for a range of applications, including Internet of Things (IoT) devices, robotics, artificial intelligence and embedded systems.
STMicroelectronics ACEPACK DMT-32 silicon carbide power modules
15 November, 2023 | Supplied by: STMicroelectronics Pty LtdThe ACEPACK DMT-32 silicon carbide power modules from STMicroelectronics combine the features of silicon carbide technology with an optimised, compact design.
Espressif Systems ESP32-C6-WROOM-1 multiprotocol modules
09 November, 2023 | Supplied by: Mouser ElectronicsThe ESP32-C6-WROOM-1 multiprotocol modules from Espressif Systems offer a turnkey solution for adding wireless connectivity to a range of applications.
Winmate W24IT3S-SPA2-R Panel PC
08 November, 2023 | Supplied by: Backplane Systems Technology Pty LtdThe Winmate W24IT3S-SPA2-R Panel PC from Backplane Systems Technology is designed to operate at a frequency of 2.4 GHz with potential turbo boosts up to 4.2 GHz.
