HeTech industrial design solutions
23 July, 2013 | Supplied by: HetechHeTech, an Australian design and manufacturing solutions (turnkey) company, is adding a new service to its portfolio - industrial design.
Aldec Spec-tracer unified requirements life cycle management application
23 July, 2013 | Supplied by: Aldec ANZ Pvt LtdAldec’s Spec-tracer is a unified requirements life cycle management application designed specifically for FPGA and ASIC designs. Spec-tracer facilitates requirements capture, management, analysis, traceability and reporting that seamlessly integrates with windows-based HDL design and simulation tools.
Electrolube hexane-free flux remover
19 July, 2013 | Supplied by: HK Wentworth Pty LimitedElectrolube has developed a hexane-free flux remover (HFFR) for use during PCB manufacturing. HFFR is a fast-drying cleaning solvent that eliminates the use of the hazardous material n-hexane. Flux removers commonly consist of a blend of solvents, which can contain low levels of n-hexane - a solvent that has been identified as hazardous to human health.
RS Components launches open source design centre
11 July, 2013RS Components has launched its Open Source Design Centre, a comprehensive free guide to open source electronics design hosted on designspark.com, the company’s online resource for electronics design engineers.
New model for estimating electronic smog
04 July, 2013A mathematical model that predicts the electromagnetic radiation produced by circuit boards could help to improve designs and lower costs.
Heineken’s LED interactive beer bottle
03 July, 2013Dutch brewer Heineken has introduced the world’s first smart beer bottle - Ignite - that can interact with other Ignite bottles, its environment and the people around it. The interactive bottle uses microsensors and wireless networking technology to sense the moment when a bottle is being used to say ‘cheers’.
KORE Global Connect M2M global SIM card
01 June, 2013 | Supplied by: KORE Wireless Asia Pacific Pty LtdKORE Global Connect is a specialist M2M solution for companies with a multicountry market view. By establishing relationships with multiple carriers across the world, Kore can provide significant advantages to M2M device manufacturers who are looking to either distribute their device globally, require access to multiple carriers in one country or who have assets that move across multiple borders.
RS Components DesignSpark PCB version 5.0
27 May, 2013 | Supplied by: RSThe DesignSpark PCB version 5.0 from RS components integrates two additional features within the free design tool - online Design Rule Checking and buses.
Electronics innovation wins Global Innovation Award
13 May, 2013A plastic-enclosed electronics manufacturing system developed at Griffith University has won a Global Innovation Award. The revolutionary construction method has been acknowledged by an industry-reviewed panel as one of the best early-stage innovations in the world, with the greatest potential for a specific industry sector.
FabStream integrated printed circuit board (PCB) design and manufacturing solution
02 May, 2013 | Supplied by: Satcam & RTD Circuit DesignThe FabStream integrated printed circuit board (PCB) design and manufacturing solution is targeted at the DIY electronics market that consists of small businesses, start-ups, engineers, inventors, hobbyists and other electronic enthusiasts.
Shrinking labs to the size of a computer chip
02 May, 2013Microfluidic devices are allowing microelectronic engineers to shrink laboratories to the size of a computer chip. By ferrying reagents through a series of microscopic channels and reservoirs carved into a flat plate, researchers can develop new chemical reactions or monitor the cellular effects of drugs on a much smaller scale, potentially saving time and money.
Upgraded PCB design
08 April, 2013 | Supplied by: Hybrid Electronics Australia Pty LtdHybrid Electronics Australia manufactures thick film hybrid (hybrid) electronic circuits which can replace PCBs, be integrated with PCBs or upgrade PCBs.
Lattice Semiconductor iCE40 LP384 FPGA
04 April, 2013 | Supplied by: Allyanz Pty LtdThe iCE40 LP384 FPGA from Lattice Semiconductor is the smallest member of its expanding iCE40 family of ultralow-density FPGAs.
Vishay ThermaSim 3.0 online thermal simulation tool
02 April, 2013 | Supplied by: Future ElectronicsVishay Intertechnology has introduced the latest version of its free ThermaSim online thermal simulation tool for power MOSFETs, microBUCK power ICs and DrMOS products: ThermaSim 3.0.
EMC design technology based on power supply
02 April, 2013 | Supplied by: DLPC Pty LtdThis article introduces how you might implement design ideas and design methods of power supplies, which are essentially the energy heart of every system, encompassing the whole machine and its electromagnetic compatibility problems.
