Articles
Bringing embedded chips to smart devices
Microchips are found in every modern electronic device from mobile phones to kitchen appliances. But as users demand more processing power on an ever smaller scale, bulky chips mounted on printed circuit boards are running out of room.
[ + ]Throwing some light on electromagnetic fields
Testing the effect of electromagnetic fields on humans to find out if CFLs are safe to use. [ + ]
Ensuring redundancy in critical systems
Probably no other issue generates more discussion or confusion in the electrical market than how to correctly implement a redundant power supply system.
[ + ]Reliability drive for vehicle connectors
Rugged connectors are meeting the rapidly changing requirements of the modern motor vehicle platform. Today’s vehicles are heading into new territory, due to smart and adaptable interconnect products.
[ + ]Tiny soldering iron can control chemical patterns
Researchers with the US Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab) have shed light on the role of temperature in controlling a fabrication technique for drawing chemical patterns as small as 20 nm.
[ + ]European PV market faces sharp decline
Rapidly falling prices in the first half of this year have been unable to stimulate the faltering European photovoltaic market, according to the latest Solarbuzz European PV Markets report.
[ + ]Quantum dots throw more light on LEDs
By nestling quantum dots in an insulating egg-crate structure, researchers at the Harvard School of Engineering and Applied Sciences have demonstrated a new architecture for quantum-dot light-emitting devices (QD-LEDs).
[ + ]Polymer may give better lithium batteries
Lithium-ion batteries are everywhere, in smart phones, laptops, an array of other consumer electronics and the newest electric cars. Good as they are, they could be much better, especially when it comes to lowering the cost and extending the range of electric cars. To do that, batteries need to store a lot more energy.
[ + ]S-parameters are a sine of the future
If you work with high-speed serial links such as PCIe, USB, SATA, Infiniband or gigabit ethernet, you have encountered S-parameters. This method of describing the electrical properties of interconnects, standard in the microwave world for more than 60 years, is becoming the de facto standard in the high-speed digital world as well.
[ + ]Making PCBs EMC compliant
PCB board design is often governed by established cost aspects. If a designer comes up with an EMC-proof design (in theory difficult, if not impossible to achieve without actually testing it as a product), they are likely to hear that it’s going to be expensive to lay it out according to their wishes.
[ + ]Module without bond wires, solder and thermal paste
Power module packaging is driven by the ever-increasing demand for higher power densities, reliability improvements and further cost reductions.
[ + ]Solar cells reach new efficiency level
The Belgian research centre imec, together with Plextronics and Solvay, has produced an organic polymer-based single junction solar cell with 6.9% performance in an inverted device stack.
[ + ]Choke filtering, EMI and ethernet
Common mode chokes filter common mode EMI currents without causing signal degradation and without derating under high currents. These components are applied to pairs of conductors - supply and return.
[ + ]Impact of materials on microwave cable performance Part 2
The environments in which microwave cable assemblies are being used today are becoming more challenging with exposure to such conditions as extreme temperatures, chemicals, abrasion and flexing. Additional challenges include the need for smaller, lighter packaging for cable systems that last longer and cost less.
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