Major changes necessary for thermal management of LEDs
10 April, 2018LED manufacturers are set to be affected by changes regarding the thermal management of LEDs, driven by two major factors surrounding the issue of silicone.
Electrolube HTCX_ZF non-silicone, zinc oxide-free thermal paste
12 January, 2018Electrolube has launched a non-silicone heat transfer compound known as HTCX_ZF. The high-performance thermal management paste is an entirely zinc oxide (ZnO)-free version of HTCX, with improved thermal conductivity, lower oil bleed and lower evaporation weight loss.
Electrolube TPM350 and TPM550 phase change materials
31 August, 2017TPM350 and TPM550 phase change materials offer high thermal conductivity, low phase change temperatures and low thermal resistance at the interface.
IPETRONIK M-THERMO2 HV CAN temperature-measuring module
31 January, 2017IPETRONIK has released the M-THERMO2 HV — a CAN temperature-measuring module with four type K thermocouple inputs offering maximum protection on high-voltage potentials up to ±846 V.
DuPont Temprion thermal management materials
07 November, 2016The DuPont Temprion thermal management materials are completely non-silicone and include thermal greases, thermal gap fillers, electrically insulating films and adhesive thermal tapes.
Fluke TiS55 Infrared Camera
19 August, 2016The Fluke TiS55 Infrared Camera is designed for the quick identification of potential electrical, automotive, mechanical, HVAC/R and product development issues.
Can putting sand in your computer be a good thing?
15 July, 2016Sand in your computer sounds like something you'd like to avoid, right? Well, a research team at Georgia Institute of Technology is deliberately introducing sand into computers to help cool them.
White graphene could help control heat in electronic devices
17 July, 20153D white graphene could help control heat in electronic devices, according to Rice University researchers.
PerkinElmer TMA 4000 thermomechanical analysis system
21 November, 2013With the industrial test requirements and the material changes needed to meet RoHS regulations, understanding the thermal expansion of material is integral to the manufacturing process. PerkinElmer has introduced the TMA 4000, a thermomechanical solution to measure thermal expansion in electronic materials and other products. Additionally, the product can detect potentially harmful materials to ensure all electronic products are safe.
Innovative self-cooling thermoelectric system for renewable energy power stations
16 April, 2013Researchers at the UPNA/NUP-Public University of Navarre have produced a prototype of a self-cooling thermoelectric device that achieves ‘free’ cooling of over 30ºC in devices that give off heat.
National Instruments PXIe-4357 RTD module for PXI Express
29 May, 2012National Instruments has announced the NI PXIe-4357 RTD module, the latest addition to its SC Express sensor measurement family for PXI Express. The high-performance module is optimised for temperature measurements with Pt100 RTD sensors for a variety of thermal monitoring applications.
TE Connectivity polyester labels
28 March, 2012TE Connectivity has developed bubble-free polyester labels that support clear identification and readability of instructional labels.
Hart 1523 NATA precision handheld thermometer
23 December, 2011 byAvailable to rent, the Hart 1523 NATA precision handheld thermometer accurately measures, graphs and records PRTs, thermocouples and thermistors, using a wide measurement range.
Taconic RF-301 microwave laminate
05 April, 2011 byThe RF-301 from Taconic is a development of the company’s RF-30 generation. Highest PIM (passive intermodulation) performance, coupled with a good price/performance ratio, is claimed to make it the new standard for DK 3.0 substrates.
Clarke & Severn RF-35A2 power amplifier substrate
16 August, 2010 byRF-35A2 is designed with an ultra-low fiberglass content to achieve‘best in class’ insertion-loss properties and a homogeneous dielectric constant throughout the laminate.
