STMicroelectronics VNF9Q20F automotive circuit breaker
10 July, 2024The STMicroelectronics VNF9Q20F automotive circuit breaker enhances boardnet voltage stability and prevents PCB traces, connectors and wire harnesses from overheating.
Materials display unique combo of stiffness, thermal insulation
07 June, 2024 by Matt Shipman, NC State UniversityResearchers have engineered materials that are stiff and capable of insulating against heat. This could support the development of thermal insulation coatings for electronic devices.
Scientists demonstrate solid-state thermal transistor
01 March, 2023Scientists have developed a stable solid-state electrochemical thermal transistor to manage the heat produced by electronic devices during usage.
Advantech NVMe Gen. 4 SSD Solutions, SQFlash 930 and ER-1
01 November, 2022The Advantech SQF 930 and ER-1 series are available in M.2 2280 and U.2 (SFF-8639) sizes to accommodate diverse requirements.
MXene composite used to reduce electromagnetic interference
20 October, 2022Researchers from Drexel University have demonstrated how an MXene polymer coating can block and absorb electromagnetic interference.
EXAIR Vortex tubes
01 October, 2022EXAIR Vortex Tubes provide a maintenance-free solution to a variety of industrial spot cooling problems.
Blueshift RockeTape thermal insulation tapes
25 August, 2022The Blueshift RockeTape thermal insulation tapes feature AeroZero structured air polymeric aerogel technology to provide low thermal conductivity and diffusivity.
Electrolube GF400 thermal gap filler
06 July, 2021GF400 is a two-part, liquid silicone-based gap filler, which can either be cured at room temperature or accelerated with heat.
Dow DOWSIL TC-4040 Dispensable Thermal Pad
17 July, 2020Dow's DOWSIL TC-4040 Dispensable Thermal Pad is a thermal interface material (TIM) that is easy to dispense, resists slumping and provides strong thermal conductivity.
Dow DOWSIL TC-3065 Thermal Gel
15 July, 2020Dow has introduced DOWSIL TC-3065 Thermal Gel — a one-part, thermally conductive gel developed to dissipate high amounts of heat away from sensitive electronic components.
Electrolube GF300 and GF400 thermal gap fillers
04 March, 2020The GF300 and GF400 thermal interface materials are two-part, liquid silicone-based fillers that provide thermal performance of 3 W/mK (GF300) and 4 W/mK (GF400).
DuPont Zytel HTNFR42G30NH polyamide resin
07 February, 2019DuPont Transportation & Advanced Polymers has available the DuPont Zytel HTNFR42G30NH — a non-halogenated, flame-retardant, high-performance, bio-based PPA for SMT (surface mount technology) connectors and a broad range of electrical components.
Electrolube GP300 and GP500 thermal gap pads
25 June, 2018Electrolube's thermal management range includes two silicone-based product lines: the thermal gap pads GP300 and GP500.
IPETRONIK M-TDC Thermomodule
16 May, 2018IPETRONIK's M-TDC Thermomodule is equipped with a special contacting technology, allowing the plugless upgrade of thermocouple measuring points. The sensor cable is directly inserted into the module, contacting and interlocking automatically.
Holey silicon keeps electronic devices cool
19 April, 2018Thermoelectric cooling can be better facilitated with the help of holey silicon — a computer chip wafer with tiny, vertically etched orifices that work to shuttle heat to desired locations.
