Electrolube GF300 and GF400 thermal gap fillers

Electrolube’s latest thermal gap fillers provide an effective heat transfer solution for many different applications. The GF300 and GF400 thermal interface materials are two-part, liquid silicone-based fillers that provide thermal performance of 3 W/mK (GF300) and 4 W/mK (GF400). Both products reduce the risk of air pockets forming by effectively filling the entire heatsink, making them suitable for applications where the gap is non-uniform such as between multiple components and a collective heatsink/case.

Using a simple 1:1 mix ratio in either 50 or 400 mL cartridges, for hand or machine application, the fillers are applied in a soft flexible ‘putty’ that can be easily moulded around different shaped housings with low stress on components. Following application, the gap fillers can be cured at room temperature or accelerated with heat. They provide a wide operating temperature range between -50 and +200°C and have low viscosity to enable easy dispensing. After curing, the products form a low modulus elastomer, preventing the pump-out phenomenon of the thermal interface layer from the bond line and ensuring minimal degradation of heat dissipation. Both gap fillers are UL approved with the UL94 V-0 flame retardancy rating and RoHS compliant.

Thermal gap fillers are typically used in touch screen and mobile applications, but the GF300 and GF400 are versatile enough for more diverse applications. Areas of use include consumer electronics, printed circuit board assembly, housing electronic components discretely, telecoms applications such as data centre servers and fibre-optic equipment, lighting and LEDs applications, power electronics, and ECUs and HEV/ NEV batteries in automotive electronics. More recently, Electrolube has seen demand surge for engine and transmission control modules, memory modules for PCs and laptops, power conversion equipment for applications such as chargers, power grid, solar panels and wind turbines, semiconductors, microprocessors/graphic processors, and MOFSET arrays with common heat sinks, such as field effect transistors.