Cooling methods for electronic equipment
01 September, 2023Excessive heat in equipment reduces its service life and adversely impacts its performance. Proper selection of cooling elements can help avoid these negative effects.
Electronics could stay cool by 'sweating'
24 January, 2020Mammals sweat to regulate body temperature, and now Chinese researchers are exploring whether our phones could do the same.
Wakefield-Vette SKV Series skived fin heat sinks
25 June, 2019The SKV Series skived fin heat sinks, from Wakefield-Vette, are designed to support the latest trends in renewable energy, industrial electrification and transportation.
How to master power density for motor drives
19 July, 2017 by Stefan Hopfe* and Stefan Häuser^How can motor drive costs be optimised? The answer is by improving the power density through reducing the thermal impedance of the power system.
CUI extruded and stamped aluminium heat sinks
09 June, 2017CUI's aluminum heat sinks, available in both extruded and stamped versions, are compatible with TO‑218, TO‑220, TO‑252 and TO‑263 transistor packages.
EXAIR small 316 stainless steel cabinet cooler systems
08 May, 2017The EXAIR small 316 stainless steel cabinet cooler systems with electronic temperature control keep electrical enclosures cool with -7°C air, while maintaining the NEMA 4X rating of the enclosure and resisting the heat that could adversely affect the internal components.
Jumping droplets cool mobile hotspots
06 April, 2017US researchers have reported a technique designed to address mobile hotspots, which come about through electronic devices' inability to evenly dissipate the waste heat they produce.
Vincotech Müller-Ahlhorn Thermigrease TG 20032 thermal interface material for power modules
21 October, 2015Responding to rising demand for silicone-free thermal paste, Vincotech has approved Müller-Ahlhorn Thermigrease TG 20032 for the company's power modules. MiniSKiiP modules are the first to ship with this pre-applied silicone-free thermal paste.
Advanced Thermal Solutions zipper fin heat sinks
26 March, 2015Zipper fin heat sinks from Advanced Thermal Solutions (ATS) protect components from the dangers of excess heat.
element14 heatsink for Raspberry Pi
18 November, 2013element14 has launched a heatsink for the Raspberry Pi. The product protects the microcomputer from overheating and thus reduces the risk of hardware failure.
Laird Technologies WL series liquid cooling for densely packed electronic environments
19 October, 2012The self-contained units are designed to remove a large amount of heat from densely packed electronic environments.
Laird Technologies Tflex SF600 DF thermal gap filler
15 November, 2010 byThe Tflex SF600 DF has been added to Laird Technologies’ Tflex thermal gap filler range. The pad offers a compliant, silicone-free elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.8 W/mK to 3.0 W/mK.
Laird Technologies Clarke & Severn Tflex XS400 thermal gap filler
15 November, 2010 byThe Laird Technologies Tflex XS400 series is the latest thermal pad in the thermal gap filler range, offering a compliant elastomer filler specifically designed to provide moderate thermal performance with a conductivity of 2.0 W/mK.
Heat sink front panels
28 July, 2009Elma Electronic has released a range of front panels that are also heat sinks. The panels dissipate heat while covering open sections of an enclosure.
Machined components
13 March, 2009Insotec Australia supplies precision machined components produced to exacting quality standards that are used in a wide range of industries, including ticketing, communication, medical, aerospace and industrial equipment.
