Laird Technologies Tflex SF600 DF thermal gap filler

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The Tflex SF600 DF has been added to Laird Technologies’ Tflex thermal gap filler range. The pad offers a compliant, silicone-free elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.8 W/mK to 3.0 W/mK.

Available in thicknesses from 0.25 to 1.5 mm, this soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.

It also includes differential tack on one side and is dry to the touch on the other side, making for easy assembly.

It passes ‘cleanliness’ testing requirements and is rated for IDEMA M11-99, M7-98, M12-99 and M13-99 standards. The gap filler pad is RoHS compliant and is certified to UL 94V0 flammability rating.