Nordic Semiconductor nRF52840 multiprotocol system-on-chip
18 July, 2018 | Mouser Electronics (Hong Kong) LtdThe nRF52840 is a multiprotocol system-on-chip (SoC) that offers simultaneous Bluetooth 5 and Thread support.
Magellan Power Stand Alone Power System
17 July, 2018 | Magellan PowerMagellan single- and three-phase Stand Alone Power Systems are designed to operate independently of the grid, maximising the use of renewable energy.
Toshiba TLX9309 analog output IC photocoupler
16 July, 2018 | Toshiba (Australia) Pty LtdThe TLX9309 analog output IC photocoupler enables high-speed communications in automotive applications — especially electric vehicles (EV) and hybrid electric vehicles (HEV).
Argon Corporation ARD27 rugged display monitor
16 July, 2018 | Metromatics Pty LtdThe ARD27 rugged display monitor has successfully passed airborne qualification testing parameters, including environmental, EMI and safety and abuse testing, regarding airborne C4ISR applications.
Ersa i-CON 1V and i-CON 2V soldering and desoldering stations
13 July, 2018 | Machinery Forum Pty LtdTogether, Ersa's i-CON 1V and 2V control units are able to drive eight different soldering tools.
Nordson SELECT selective soldering systems
13 July, 2018 | Oritech Pty LtdThe Nordson SELECT range of selective soldering systems caters for different requirements from low to high volume.
STMicroelectronics ASM330LHH precision MEMS sensor for automotive navigation
13 July, 2018 | STMicroelectronics Pty LtdSTMicroelectronics has introduced the automotive-grade ASM330LHH six-axis inertial sensor for super-high-resolution motion tracking in advanced vehicle navigation and telematics applications.
Fujikura FSM-70S Core Alignment Fusion Splicer
12 July, 2018 | TechRentalsThe Fujikura FSM70S is suitable for single-fibre, core alignment fusion splicing and comes in a transit case with a CT30A cleaver and work table.
Interflux Electronics LMPA-Q low melting point alloys
12 July, 2018 | Oritech Pty LtdInterflux Electronics' LMPA-Q range of low melting point alloys (LMPAs) is designed to allow users to use soldering temperatures that are lower than for traditional lead-free Sn(Ag)Cu (SAC) alloys.
INVENTEC ECOREL FREE 305-16LVD solder paste
12 July, 2018 | Onboard SolutionsECOREL FREE 305-16LVD is a no-clean, lead-free solder paste developed with the chemistry of the ECOREL solder paste range. The product is suitable for standard convection reflow and vapour phase soldering.
L-Boxx Mini splicing connector sets
11 July, 2018 | WAGO Pty LtdThe 221 Series 4 and 6 mm2 splicing connectors are now available in two different L-Boxx Mini sets. The sets include an assortment of WAGO's splicing connectors for different types of wires and a range of cross-sections.
Mornsun R3 series fixed input DC converters
11 July, 2018 | DLPC Pty LtdMornsun's R3 series fixed input DC converters offer solutions to common issues with power supply design.
iEi Integration UPC-F12C-ULT3 industrial panel PC
11 July, 2018 | ICP Electronics AustraliaThe UPC-F12C-ULT3 is the latest in panel PC technology from iEi Integration. The system is powered by Intel's 6th Generation Skylake i5 and Celeron ULT processors, allowing the panel PC to be completely fanless.
Techman Robot collaborative robots
11 July, 2018 | Onboard SolutionsTechman Robot's collaborative robots are useful for automating various tasks around the factory and can help implement any automated Industry 4.0 projects users may have in mind.
HW Technologies Smart Klaus Industry 4.0 workplace
10 July, 2018 | HW TechnologiesThe Smart Klaus Industry 4.0 workplace takes advantage of data by reflecting it to workers in a lean process. It is based around a four-step principle — guidance, verify, confirm, document — that divides even complex work processes into clear and structured sub-processes.
