Design > ICs

Maxim Integrated MAX16993 PMIC for automotive applications

25 February, 2014

The Maxim Integrated MAX16993 power-management integrated circuit (PMIC) is a 2.1 MHz, multichannel, DC-DC converter. The device integrates three supplies in a small footprint. It includes one high-voltage step-down controller (OUT1) designed to run directly from a car battery and two low-voltage step-down converters (OUT2/OUT3) cascaded from OUT1. Under no-load conditions, the product consumes only 30 µA of quiescent current, making it suitable for automotive applications.


Sundance SMT166 dual-FPGA development platform

30 January, 2014

Sundance Multiprocessor Technology has launched the SMT166 dual-FPGA platform for R&D into the use of large FPGAs for high-performance reconfigurable computing and large-scale embedded systems applications, as well as system-on-chip (SoC) simulation.


Rohde & Schwarz wins design down-select for the Royal Navy's Combat Ship

13 September, 2013

Rohde & Schwarz UK has been down-selected after a 12-month competition process run by BAE Systems to be the preferred partner for the design phase of the integrated communications system for the Royal Navy's Future Type 26 Global Combat Ship.


Microchip real-time clock/calendar

30 July, 2013

Microchip provides a wide range of real-time clocks/calendars, from basic devices to a variety of mid-range devices that are highly integrated.


New model for estimating electronic smog

04 July, 2013

A mathematical model that predicts the electromagnetic radiation produced by circuit boards could help to improve designs and lower costs.


KORE Global Connect M2M global SIM card

01 June, 2013

KORE Global Connect is a specialist M2M solution for companies with a multicountry market view. By establishing relationships with multiple carriers across the world, Kore can provide significant advantages to M2M device manufacturers who are looking to either distribute their device globally, require access to multiple carriers in one country or who have assets that move across multiple borders.


Electronics innovation wins Global Innovation Award

13 May, 2013

A plastic-enclosed electronics manufacturing system developed at Griffith University has won a Global Innovation Award. The revolutionary construction method has been acknowledged by an industry-reviewed panel as one of the best early-stage innovations in the world, with the greatest potential for a specific industry sector.


FabStream integrated printed circuit board (PCB) design and manufacturing solution

02 May, 2013

The FabStream integrated printed circuit board (PCB) design and manufacturing solution is targeted at the DIY electronics market that consists of small businesses, start-ups, engineers, inventors, hobbyists and other electronic enthusiasts.


Achronix 22 nm Speedster FPGAs

12 March, 2013

Built on Intel’s 22 nm, 3-D Tri-Gate transistor technology, Speedster22i HD devices are FPGAs with a full suite of hardened interface IP including 10/40/100 G ethernet, 100 Gbps Interlaken, PCI Express Gen1/2/3 and 2.133 Gbps DDR3 controllers.


So, who’s doing what with graphene?

08 March, 2013 by Mike Smyth, senior technical writer

From super-fast electronics to detecting illicit drugs and finding viruses in humans - these are some of the promises of a new substance that has scientists worldwide super excited. The substance is graphene and it is poised to become the wonder material of the 21st century if intense research activity on many fronts comes up to expectations and creates a whole new generation of products.


Ultralow-cost plastic circuits poised to reduce world food wastage

08 March, 2013

Researchers have invented a plastic analog-digital converter that brings plastic sensor circuits costing less than one euro cent within reach. Beyond food, these ultralow-cost plastic circuits have numerous potential uses, including pharmaceuticals.


FTDI FT313H host controller IC

01 February, 2013

The FT313H host controller IC supports USB 2.0 high-speed (480 Mbps), full-speed (12 Mbps) and low-speed (1.5 Mbps) implementations. Designed for easy integration, it adds high-speed connectivity capability into a system through its support of standard USB class drivers.


International Rectifier IR3230SPbF gate drive IC simplifies eBike design

16 January, 2013

International Rectifier has introduced the IR3230SPbF three-phase gate drive IC for e-bike inverters, providing efficient electric mobility.


Metamaterials manipulate light on a microchip

30 November, 2012

Using a combination of the new tools of metamaterials and transformation optics, engineers at Penn State University have developed designs for miniaturised optical devices that can be used in chip-based optical integrated circuits, the equivalent of the integrated electronic circuits that make possible computers and mobile phones.


Making fast transistors from graphene

23 November, 2012 by John Toon

By fabricating graphene structures atop nanometre-scale ‘steps’ etched into silicon carbide, researchers have for the first time created a substantial electronic bandgap in the material suitable for room-temperature electronics. Use of nanoscale topography to control the properties of graphene could facilitate fabrication of transistors and other devices, potentially opening the door for developing all-carbon integrated circuits.


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