Why SEHO Selective Systems are changing the way manufacturers solder boards using through hole designs
17 May, 2024 by Hawker RichardsonThis article looks at the solutions for Soldering through hole boards from SEHO and why the technology they've employed could be a game changer for manufacturers requiring Wave and/or Selective solutions.
Interflux SAC305 DP5505 solder paste
02 May, 2024The Interflux DP5505 solder paste is designed for a range of applications and offers stability under different temperature and humidity conditions.
SCHURTER OGN Series open fuse holder
01 April, 2023The SCHURTER OGN series open fuse holder is compatible with through-hole reflow (THR) solder processes for fully automated PCB assembly.
JNASE high-precision hot air station
07 March, 2023JNASE is a hot air station that is designed to rework SMDs without affecting nearby components.
Thermaltronics TMT-R8000S soldering robot
01 March, 2023The Thermaltronics TMT-R8000S Soldering Robot from Chemtools features an observation mode, a verification mode and decision-making capabilities.
SCHURTER OGN series open fuse holder
07 October, 2022The SCHURTER OGN series open fuse holder is Through-Hole Reflow (THR) compatible for fully automated PCB assembly.
Würth Elektronik WE-SMGS solderable seal
28 October, 2019Würth Elektronik's WE-SMGS is a solderable seal for surface mounting. The product consists of a temperature-resistant foam material, which combines the conductive seal with high elasticity.
Neoden IN6 reflow oven
13 September, 2019The Neoden IN6 reflow oven was carefully designed with proper heating elements and next-generation sensors that ensure consistent and even heating throughout the entire length of the process chamber.
EXAIR 1/8 NPT small internal mix spray nozzles
22 May, 2019EXAIR's 1/8 NPT small internal mix spray nozzles atomise fluids up to 106 L/h. The nozzles mix the liquid and air inside the cap and produce fine atomisation. They can be used on liquids with a viscosity up to 300 cP.
Rehm VXC series convection reflow systems
13 July, 2017Rehm's VXC series convection reflow systems offer optimised heat transfer and thermal stability, with low real-world cross-profile performance, low MTBF and low power usage.
Rehm Thermal Systems Condenso XC Batch Vacuum Reflow System
11 July, 2017The Condenso XC Batch Vacuum Reflow System is suitable for high-technology, large thermal mass, difficult soldering applications.
RS Components Raspberry Pi prototyping board
16 February, 2017The RS Components Raspberry Pi prototyping board is suitable for electronics engineers, as well as being well suitable for education and the training of students and electronics beginners.
Thermaltronics TMT-HA Series hot air tools
08 October, 2015The TMT-HA200 hot air tool can be used for surface-mount component removal and reflow on packages such as SOIC, QFP, PLCC and other chip components. The TMT-HA300 hot air tool uses a large diaphragm pump and features a digital temperature readout as well as a visual air flowmeter.
Thermaltronics TZ-KIT-1 tweezer kit
18 August, 2014Soldering equipment manufacturer Thermaltronics has released a tweezer kit as an add-on accessory to its Flagship soldering station TMT-9000S-2. The TZ-KIT-1 encompasses an ergonomically designed tweezer handpiece that is suitable for reworking even the smallest components.
Hakko FX100 soldering system
08 August, 2014The FX100 soldering system brings induction heat soldering technology to a high performance level. A small, compact station includes microprocessor control that boosts the recovery performance of the soldering iron tip.
