Light-emitting diodes will become the dominant large-area TFT LCD backlight unit light source by 2011 with a 56% share, according to a DisplaySearch report.

Bishop & Associates has released a seven-chapter research report defining the World Connector Market for Renewable Energy.

Terepac Corporation and IMEC are collaborating on packaging technologies for flexible electronics.

An international team of researchers from the Netherlands, Russia and Austria has found that monolayer coverage and channel length set the mobility in self-assembled monolayer field-effect transistors (SAMFETs).

Datacraft has won a $8.9 million contract to ensure a high-connectivity and secure infrastructure for one of the world's biggest pharmaceutical company's new Asian resource centre in Singapore.

In the second quarter of 2009, the value of the total notebook PC market was $30.0 billion, up 10% but down 5% over the year, according to a new report by DisplaySearch.

Texas Instruments has opened a manufacturing facility in Richardson, Texas, believed to be the world's only production facility to use 300 mm silicon wafers to manufacture analog chips.

A partnership between Tokyo Electron (TEL) and Oerlikon Solar will make inroads into the Australian solar market and will introduce thin film photovoltaic technology.

Hitachi High-Technologies and Renesas Technology have agreed to a transfer of the semiconductor manufacturing equipment business of wholly owned Renesas subsidiary, Renesas Eastern Japan Semiconductor, to Hitachi High-Tech Instruments, a wholly owned subsidiary of Hitachi High-Technologies.

Mouser has signed a global distribution agreement with LS Research, a wireless development company.

Taiwan is being recognised as the key manufacturer of ICT products, including personal computers, notebooks, monitors and motherboards, and has cultivated a strong connector industry, ranked at three in global production value.

Kontron has acquired Digital-Logic, headquartered near Solothurn in Switzerland.

In its Quarterly LCD Glass Subsctrate Report, DisplaySearch says that TFT LCD glass tightness this year will continue as TFT LCD panel makers are increasing capacity use and demanding more glass substrate from suppliers.

IMEC has combined vapour-phase doping and sub-melt laser annealing to fabricate high-quality, defect-free, ultra-shallow junctions (USJs) with abrupt dopant profile.

In the second quarter of 2009, Asia Pacific continued its downward trend in server shipments with a 17.2% year on year decline, with shipments totaling 323,388 units.