Electronex exhibition is the biggest yet

Where: Australian Technology Park, Eveleigh, Sydney When: Wednesday and Thursday September 12 and 13 Open: Wednesday 10 am to 6 pm; Thursday 9 am to 5 pm Conference: Tuesday 9 am to 5 pm; Wednesday 8.30 am to 4.30 pm; Thursday 8.30 am to 4.30 pm

The Electronex Design and Assembly Expo opens its doors at the Australian Technology Park, Eveleigh, Sydney, from 12-13 September. This is the third year of the event, which is now 50% bigger than the first exhibition.

“This indicates the growing support and enthusiasm for a specialised industry electronics platform showcasing local Australian and New Zealand-based suppliers and distributors of the latest electronic technology for our market,” said Noel Gray, managing director of Australian Exhibitions and Events, organiser of the event.

More than 80 exhibitors will show the latest developments in components and equipment . Visitors and exhibitors will be able to share knowledge, demonstrate and bench test new devices, and have the opportunity to network and exchange ideas on future industry developments.

Design, electronic and electrical engineers, and scientific, IT and communications professionals are among those expected to attend to see a large range of equipment for test and measurement, R&D, maintenance and service and repair.

Companies such as Agilent Technologies, ADM Instruments, LeCroy, Vicom, Emona Instruments, Scientific Devices, TechRentals, Fluke and National Instruments will be among those showing their new technology and demonstrating solutions.

Electronex is a sponsor of the Future Awards that recognise excellence in the Australian electronics industry. Entries highlight the best products developed to enable the modern lifestyle with awards in these categories: wellness, environment, motor vehicles and transport, industrial, communications and networks, best in design and student. Winners will be announced at a roundtable network function.

As in the previous three years, the SMCBA is holding its international conference in conjunction with the exhibition and again speakers will be giving a variety of presentations.

On Tuesday at 2 pm, the opening day of the conference, Garry Ferrari of FTG Circuits will talk about high-density interconnect structures, while on Wednesday at 9 am, he will look at PCB design essentials and updates and on Thursday he will discuss the foundations for reducing costs during a 9 am to 5 pm presentation.

Garry is a director of technical support for FTG in the US and was given the ‘President’s Award’ in recognition of his contribution to the interconnect industry.

Also from America is Dave Hillman, a metallurgical engineer in the Advanced Operations Engineering Department of Rockwell Collins. He will also be making three presentations starting on Wednesday at 8.30 am with a paper called ‘Package on Package (POP) Technology: Manufacturing Implementation and Solder Joint Reliability’.

On Thursday he will look at the issue of tin whiskers in a presentation beginning at 8.30 am. ‘Case Studies in Non-conformance’ is the title of his final address on Thursday at 1 pm.

Craig Hillman is CEO and managing member of DfR Solutions, an organisation that specialises in design reliability. The first of his three presentations is on Wednesday at 9 am when he discusses a pathway to reliability and the physics of failure.

On Thursday at 8.30 am he looks at ‘Next Generation Technologies in Electronics Packaging and Production’, while at 1 pm on the same day he talks about contamination and cleanliness and methods of developing practical responses to a challenging problem.

Andy Kowalewski, of Premier Technology Training, has a background in avionics and has been a board designer for more than 31 years. He will discuss PCB design excellence on Wednesday at 9 am and will continue with that theme the next day at 9 am.

Terry Clitheroe, of Solder Technologies, is a Master/PC trainer and was an instructor in the RAAF. He will talk about the ‘Dos and Don’ts - Good and Bad Practices - Myths and Reality of Rework and Repair’ when he addresses delegates at 9 am on Wednesday. The following day he will again look at this topic in a presentation beginning at 9 am.

For more information on the conference, contact Andrew Pollock on (03) 9571 2200 or email: pollock@smcba.asn.au.

For more information on Electronex, contact Noel Gray/Anthony Dolan on (03) 96756 2133 or email ngray@auexhibitions.com.au or register online at www.electronex.com.au.