Components

LEDs poised to brighten our lives — Part 1

05 February, 2009 by Mike Smyth

There is little doubt that the future for light-emitting diodes is bright and getting brighter with every jump in its technology.


Components merger

05 February, 2009

Paqworks Business has joined Madison Technologies in its Industrial IT & Communications division.


More chip cores can mean slower supercomputing

05 February, 2009

The attempt to increase the speed of supercomputers by increasing the number of processor cores on individual chips unexpectedly worsens performance for many complex applications, according to simulations by Sandia.


Global agreement between Digi-Key and Tyco

04 February, 2009

Digi-Key has expanded its current franchise agreement with Tyco Electronics to a worldwide deal.


Industrial drives supply and license agreement

30 January, 2009

Fuji Electric Device Technology and Semikron International have signed a supply and license agreement.


Thin film lens array

21 January, 2009

Depositing silicon dioxide over a square-patterned substrate could turn out to be an attractive route to making arrays of micro and nanosized lenses.


Green LED development plan

20 January, 2009

IMEC, Europe's nanoelectronics research research institute, and Taiyo Nippon Sanso Corp say they will jointly develop manufacturing technology for high-efficiency LED (light-emitting diode) devices.


Gigabit switches

01 January, 2009 | Supplied by: Metromatics Pty Ltd

GE Fanuc has announced two gigabit ethernet switches.


Afolux POS fanless panel PCs

01 January, 2009 | Supplied by: ICP Electronics Australia

ICP Electronics has released the Afolux POS series of all-in-one touch panel PCs, designed for applications where cost, rugged design and limited space are important.


Micro axial fan

01 January, 2009 | Supplied by: Switches Plus Components Pty Ltd

Sepa has introduced its 10 mm micro axial fan with dimensions of 10 x 10 x 2.2 mm, a rated voltage of 3.3 and current of 0.05 A.


Fanless embedded PCs

01 January, 2009 | Supplied by: Backplane Systems Technology Pty Ltd

Backplane has announced its range of fanless PCs from 1 GHz VIA PICO systems to Core 2 Duo computers.


Optical components

01 January, 2009 | Supplied by: Caelera Pty Ltd

Finisar has available four 1310 nm optical components designed to meet the specifications of high-speed video applications.


Thyristor module

01 January, 2009 | Supplied by: Electronic Components Pty Ltd

Epcos has extended its series of thyristor modules with the TSM-LC100, designed for capacitive loads up to 100 kVAr at 400 V.


Zetex LED drivers

01 January, 2009 | Supplied by: Future Electronics

Diodes has further extended its Zetex LED driver series with the introduction of three miniature LED drivers offering improved accuracy and thermal performance.


EMC RF amplifiers

01 January, 2009 | Supplied by: Westek Electronics Pty Ltd

Teseq (formerly the instrumentation division of Schaffner) has released a range of RF broadband, power amplifiers covering frequencies to 6 GHz and with outputs to 1100 W.


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