ADAM-IoT series for automation systems
01 August, 2013Integrated with wireless functionality, power management and I/O technologies, the ADAM-2000 series are good products for data acquisition. Based on the IEEE 802.15.4 wireless standard, networks can be easily deployed and extended.
ICP DAS iDCS-8830 modular remote redundant I/O system
18 July, 2013ICP DAS has released the iDCS-8830 modular remote redundant I/O system. The product supports Modbus/TCP and Modbus/UDP with eight I/O slots designed to work in duplex or simplex applications. It provides easy installation of the I/O modules and process cabling.
NI FlexRIO adapter modules
30 May, 2013National Instruments (NATI) has expanded the NI FlexRIO product family built on FPGA-based reconfigurable I/O (RIO). Six new adapter modules add I/O including digitiser, signal generation and IF and RF transceiver capabilities.
Harting Han E QuickLock Module
24 May, 2013A version of the Han E Module from Harting is now available with Han-Quick Lock termination technology. This refinement of the established module with crimp terminals features the company’s patented engineering.
Bluegiga BLE113 small, low-power Bluetooth Smart module
17 May, 2013Bluegiga Technologies recently announced its BLE113 Bluetooth Smart module. The addition to the Bluegiga Bluetooth Smart product family offers 30% lower peak power consumption, 30% smaller size and a hardware I2C interface simplifying connectivity to MEMS peripheral sensors.
Eltek Flatpack2 Integrated 19″ 2U power system
17 April, 2013Redundancy in DC power systems has always been a challenge in industrial-type applications. In recognition of this, Eltek has fabricated the Integrated 19″ 2U power system, which is built around the Flatpack2 rectifier and designed for applications such as switchgear, telecom, emergency lighting and alarm systems. It has a compact design and is easily installed.
ICPDAS I-87024UW/I-87028UW isolated source-type voltage or current-output module
09 April, 2013The ICPDAS I-87024UW/I-87028UW is a source-type analog output module that includes 4/8 single-ended analog output channels and provides options for setting power-on and safe values.
Sierra Wireless AirPrime embedded wireless modules
12 March, 2013Sierra Wireless has introduced an architecture for embedded wireless communications, designed to simplify and accelerate the development and deployment of M2M solutions.
Alta Data Technologies MPCIE-A429 Mini PCI Express interface card
05 March, 2013Alta Data Technologies’ MPCIE-A429 Mini PCI Express F1 interface module offers a variety of ARINC-429/575/717 channel configurations with software-selectable RX/TX channels, baud rates, bit encoding and word configurations (start/sync/stop length, parity, bits/word, MSB/LSB).
Rohde & Schwarz CMW-B510F 3GPP fading simulation module
21 February, 2013Rohde & Schwarz has introduced the CMW-B510F fading simulation module for its CMW500 wideband radio communication tester.
Nextreme eTEC MA Series thin-film thermoelectric modules
14 January, 2013Nextreme Thermal Solutions has announced a series of thin-film thermoelectric modules that offer high cooling capacity, robust mechanical design and source-matched heat flux density for easier integration into existing electronic systems.
Banner Engineering SureCross B2Q Gateway Module
19 December, 2012The Banner Engineering SureCross B2Q Gateway Module has been developed to provide embeddable and cost-effective communication capabilities for the company’s Q45 wireless sensor network.
Bluegiga BT111 Bluetooth Smart Ready HCI Module
11 December, 2012Bluegiga Technologies has available the Bluetooth Smart Ready HCI module, BT111.
Kontron ESC1600/ESC2404 10G/1G ethernet switch modules
07 November, 2012For the accelerated development of custom-made, high-availability switches, Kontron has introduced its 10G/1G Ethernet Switch Core Modules, providing all essential interfaces on a standardised footprint.
ULP-COM form factor computer-on-module for imaging-centric applications
22 October, 2012Kontron has announced it now manufactures the first module to provide an NVIDIA Tegra 3 ARM processor in the scalable ULP-COM standard form factor.
