Printing innovations provide 10-fold improvement in organic electronics
03 June, 2013Researchers have developed a printing method that works with a variety of organic materials to produce semiconductors of strikingly higher quality than what has so far been achieved with similar methods.
Opening doors to foldable electronics with inkjet-printed graphene
24 May, 2013Northwestern University researchers have developed a graphene-based ink that is highly conductive and tolerant to bending. They have used it to inkjet-print graphene patterns that could be used for extremely detailed, conductive electrodes.
TDK MHQ1005P multilayer ceramic inductor range
17 April, 2012TDK has released the MHQ1005P series of multilayer ceramic inductors with a Q factor that, depending on the type, is as good or much better than comparable, wirewound inductors.
Installing flash LEDs on flex circuits
20 April, 2010 by Shereen Lim, Avago TechnologiesFor the mobile market, some PCB assemblies have been converted to flex circuit assemblies, in part because flex circuit assemblies can be twisted or bent to application needs.
Flexible electronics gets a boost
19 November, 2009Terepac Corporation and IMEC are collaborating on packaging technologies for flexible electronics.
Taking the strain of silicon
28 November, 2008University of Wisconsin-Madison engineers and physicists have developed a method of measuring how strain affects thin films of silicon that could lay the foundation for faster flexible electronics.
Move toward vehicles that morph
10 May, 2006MIT engineers report they may have found a way for structures – and materials – to move like a bird, adjusting its wings to catch every current of air, essentially morphing from one shape into another.