Components > Flexible electronics

Printing innovations provide 10-fold improvement in organic electronics

03 June, 2013

Researchers have developed a printing method that works with a variety of organic materials to produce semiconductors of strikingly higher quality than what has so far been achieved with similar methods.


Opening doors to foldable electronics with inkjet-printed graphene

24 May, 2013

Northwestern University researchers have developed a graphene-based ink that is highly conductive and tolerant to bending. They have used it to inkjet-print graphene patterns that could be used for extremely detailed, conductive electrodes.


TDK MHQ1005P multilayer ceramic inductor range

17 April, 2012

TDK has released the MHQ1005P series of multilayer ceramic inductors with a Q factor that, depending on the type, is as good or much better than comparable, wirewound inductors.


Installing flash LEDs on flex circuits

20 April, 2010 by Shereen Lim, Avago Technologies

For the mobile market, some PCB assemblies have been converted to flex circuit assemblies, in part because flex circuit assemblies can be twisted or bent to application needs.


Flexible electronics gets a boost

19 November, 2009

Terepac Corporation and IMEC are collaborating on packaging technologies for flexible electronics.


Taking the strain of silicon

28 November, 2008

University of Wisconsin-Madison engineers and physicists have developed a method of measuring how strain affects thin films of silicon that could lay the foundation for faster flexible electronics.


Move toward vehicles that morph

10 May, 2006

MIT engineers report they may have found a way for structures – and materials – to move like a bird, adjusting its wings to catch every current of air, essentially morphing from one shape into another.


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