Business

Electronic waste removal service

29 November, 2012 | Supplied by: Dimension Data Australia

Research indicates that the number of electronic devices at end-of-life will double from 2010 to 2025, and it’s estimated that over 60 million tonnes of electronic waste (e-waste) will be at the decision point for re-use, recycle or landfill in 2013.


Embedded consumer electronics device revenues to double in the next two years

28 November, 2012

Juniper Research has predicted that revenues from products and services delivered over embedded consumer electronics devices will reach $6.4 billion in 2014, as the sector emerges as a key anchor for the M2M industry.


The mad man behind the company name

23 November, 2012 by Mike Smyth, specialist technical writer

The award-winning Tesla Model S car is built by a company whose aim is to accelerate the world’s transition to affordable electric mobility. However, the man behind the company name was basically a mad scientist. Interesting, prolific, but pretty nuts.


Texas Instruments cuts 1700 jobs as part of strategic plan

16 November, 2012

Consistent with previously stated strategic plans, Texas Instruments has announced it will reduce costs, including the elimination of about 1700 jobs worldwide, so it can focus investments in its wireless business on embedded markets with greater potential for sustainable growth.


Semiconductor job growth on the up and up

16 November, 2012

Semiconductor manufacturing jobs have outpaced US job growth and increased 3.7% over last year, according to the Semiconductor Industry Association (SIA).


Hameg product availability

16 November, 2012

Hameg’s T&M products are now available directly from Rohde & Schwarz in Europe, catching up with Australia’s distribution system.


M2M market to reach 400 million units by 2017

13 November, 2012

A new study forecasts that the market for M2M and embedded devices will reach 400 million by the end of 2017, up from a little over 110 million at present.


Robotics Innovation Challenge focuses on opportunities and challenges within robotics

12 November, 2012

Robotdalen is Sweden’s foremost robotics cluster; an initiative enabling commercial success of new ideas and research within robotics and automation. Robotdalen arranges the Robotics Innovation Challenge in Eskilstuna, Sweden, on 25 April 2013.


Premier Farnell and EnOcean expand distribution partnership

12 November, 2012

Electronics distributor Premier Farnell and EnOcean have announced an expansion to their existing partnership. The announcement sees Premier Farnell now shipping small samples and low-volume quantities of EnOcean’s energy harvesting wireless sensor modules worldwide direct or via its online element14 community.


Wage premium for engineers in the UK

05 November, 2012

Wage premiums and demand continuing to outstrip supply are two of the focal points of a recent Royal Academy of Engineers report which also emphasises the need for more science, engineering, technology and mathematics uptake at school levels.


Harmonised standards under the Low Voltage Directive for Europe

31 October, 2012

A new list of harmonised standards under the Low Voltage Directive 2006/95/EC was announced in the Official Journal of the European Union (OJ C 245) last August.


IGT Industries acquired by Stadium Group

25 October, 2012

The acquisition supports a strategy to build an electronic business with a portfolio of adjacent products and technologies.


Renesas and Braemac sign distributor agreement

25 October, 2012 | Supplied by: Braemac Pty Ltd

Under this agreement, Braemac plans to offer the full range of Renesas products.


Samtec RF interconnect catalogue

23 October, 2012 | Supplied by: Samtec USA

It offers customers 24-hour free samples, no minimum order quantities and two- to three-day lead times for standard product orders.


ISO26262 compliance for automotive ICs and semiconductor devices

22 October, 2012 by Thomas Mueller, Product Manager, ams AG | Supplied by: Future Electronics

The adoption of the ISO standard initially gave rise to major concerns about an increase in development costs and device die sizes within the semiconductor industry.


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