Industry News
Contactless agreement
NXP, the independent semiconductor company founded by Philips and Renesas Technology, has expanded the licensing agreement on NXP's MiFare technology.
[ + ]Connector review
Bishop & Associates has released a 218-page, five-chapter report providing an overview of the Chinese connector market.
[ + ]RF shielding deal
Richardson Electronics will now sell WL Gore's range of surface-mountable EMI shielding materials including Gore-Shield Supersoft SMT EMI gaskets and grounding pads, and the snapShot board-level EMI shield.
[ + ]Digi-Key enhancer range
Digi-Key has expanded its range of Tyco Electronics Raychem circuit protection products to include the PolyZen family of polymer-protected zener diodes.
[ + ]LCD distribution
Mouser Electronics has signed a distribution agreement with Electronic Assembly, a supplier of LCD modules.
[ + ]Hong Kong signing
The Electronics and ICT Association (EICTA) has signed an agreement with the Hong Kong Wireless Technology Association.
[ + ]Working towards interoperability
Symantec has announced the Open Collaborative Architecture and a third-party developer program to establish greater interoperability with Symantec solutions.
[ + ]Phone chip under joint development
NTT Docomo, Renesas, Fujitsu and Sharp plan to jointly develop the SH-Mobile G4 single-chip LSI device, and a platform incorporating it, to support the HSUPA/HSDPA/W-CDMA and GSM/GPRS/EDGE (2G) mobile telephony standards.
[ + ]Circuit board maker wins award
Lonsdale-based electronics company Redarc Electronics has won the Environmental Sustainability Award for minimising its environmental footprint and contributing to a more sustainable future.
[ + ]Sponsors support design competition
National Semiconductor, Ohmrite Manufacturing and Vishay have become global sponsors for the Farnell 2008 Live EDGE Electronic Design Competition for the global environment.
[ + ]Printable dielectrics set to boom
A NanoMarkets report predicts that the boom in TOP electronics will drive a similar boom in printable dielectrics.
[ + ]European franchise
Farnell has signed a European franchise agreement with electronics component manufacturer TDK.
[ + ]Blade spec may become standard
SiliconSystems has contributed its SiliconDrive II Blade specification to the Small Form Factor Special Interest Group (SFF-SIG) to create an official governing standard.
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