Thermally conductive gap fillers
The idea is to make devices faster, sleeker, more compact & powerful, yet the challenge is to do so without over-heating.
Laird Technologies' thermally conductive gap fillers are future generation compliant cooling materials. They offer soft and highly thermally conductive gap fillers available in thicknesses from 0.25mm to 5.08mm.
Laird Technologies' gap fillers are soft and very compliant. They afford designers and engineers the most flexibility in dimensional tolerance. Extreme compliancy reduces stress on components while higher thermal conductivity provides the thermal performance required for next generation designs.
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