Laird Tlam OptoTEC Series miniature thermoelectric modules

Laird has announced a series of miniature thermoelectric modules (TEMs) built using Laird Tlam thermally conductive circuit boards instead of traditional ceramic-based circuit boards.

The Tlam OptoTEC series is designed for applications where temperature stabilisation of sensitive optical components in photonics, telecom, medical and consumer markets is critical. The use of the circuit board is claimed to improve the heat pumping capabilities of the device while providing good heat spreading, improved reliability and lower cost in high volume when compared to traditional heat removal systems.

Tlam is used in applications where the components in the circuit produce a lot of heat, such as high-powered LEDs, power supplies or motor drives. The circuit boards feature a thin layer of thermally conductive dielectric material sandwiched between a top layer of standard copper foil and a thick metal backing plate for structural strength and improved heat spreading. The heat is transported off the bottom of the circuit board where the metal backing plate quickly carries heat laterally away from hot components, reducing their temperature and extending their lifetime.

The combination of the circuit board with the thermoelectric can reduce the complexity of moving heat away from sensitive devices. The series includes seven modules that can create a temperature differential (ΔT) of up to 67°C and pump from 1.5 to 9 W of heat at an ambient temperature of 25°C. At 85°C, the series can create a ΔT of 77°C and pump 1.6 to 9.9 W of heat.

The modules have passed Telcordia GR-468-CORE Issue 2 reliability qualification testing and are customisable to accommodate alternate sizes, heat pumping capacities, circuit patterns and pre-tinning requirements.