Heat conductive EMI suppression sheets have been developed by FDK in its SE series.
They are designed to be effective at EMI suppression and thermal conductivity. The flexibility of them allows fitting to the surface irregularities of chips on a circuit board as they can be placed between the board and the shield casing.
For example, the sheets give simultaneous noise and heat protection by being placed between the CPU and the heat sink.
Online:
www.tokyocompo.com
Phone: 02 9836 2899
Phone: 02 9836 2899
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