Samtec joins EIA ibis open forum
Sunday, 01 February, 2004
Samtec's support of the IBIS Interconnect Modelling Specification (ICM Version 1.0) and early adoption of this specification for interconnect modelling has resulted in an invitation to join the IBIS Open Forum as a member organisation. IBIS (I/O Buffer Information Specification ) is entering its thirteenth year as an industry-wide standard method for describing buffer electrical behaviour including databook buffer timing and signal integrity requirements.
With the approval of the IBIS ICM Specification, interconnect information can now be exchanged in a standard format. Samtec will be adding IBIS models meeting the ICM version 1.0 specification to its library of interconnect models and high-speed characterisation test data for its most popular connectors.
These models are available for download at http://www.samtec.com/ with new models being added as they become available. Samtec has a 'no NDA, instant download' policy along with multiple formats of the models. They are compatible with the most popular, currently available simulators. Samtec models have been packaged for use in the Cadence SPECCTRAQuest (.dml), Mentor ICX (mmf) and HyperLynx LineSim (.slm).
Power electronics market set to grow
After two years of stagnancy, the power semiconductor devices market is set to prosper, according...
Faster multicore chips
Computer chips' clocks have stopped getting faster. To keep delivering performance...
Extreme-temperature electronics
Many industries are calling for electronics that can operate reliably in a harsh environment,...