Mitsubishi and IBM to develop mobile phone chips
The two companies intend to accelerate the introduction of high performance, low power microchips for 3G mobile phones.
They are designing radio frequency integrated circuit (RFIC) chipsets for 3G wireless handsets. The highly integrated chipsets will be based on Mitsubishi's cellular circuit and system expertise and manufactured by IBM using its silicon germanium (SiGe) communications chip technology. Mitsubishi intends to use the RFICs in its next-generation mobile products.
The SiGe chipsets include 3G receiver and transmitter parts optimised to efficiently manage high frequency signals while reducing power consumption and overall system cost through high levels of integration. Designing 3G RFIC with SiGe technology allows the combination of multiple chips into complex, integrated parts, reducing the number of chips required by handsets. In addition SiGe will help chipsets consume less power compared to competitive manufacturing technologies, thereby extending battery life and talk time.
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