Dialog Semiconductor SmartBond Multi-Sensor Kit

Dialog Semiconductor’s SmartBond Multi-Sensor Kit is a complete multisensor node solution that enables engineers to develop multiple applications on the same hardware and support different use cases through firmware.

The small and low-power wireless sensor kit is built on Dialog’s DA14585 SmartBond system-on-chip (SoC) and integrates TDK InvenSense motion sensors and Bosch Sensortec environmental sensors for 15 degrees of freedom (DOF) in Internet of Things (IoT) applications. It combines Bluetooth 5 wireless communications and an Arm Cortex-M0 processor with an accelerometer, gyroscope, magnetometer and environmental sensors in an effort to help reduce development time, enable rapid proof of concept and accelerate time to market.

The kit offers flexibility across hardware and software that includes extensive cloud support, ranging from IFTTT for the creation of simple applets to the creation of advanced workflows for data analytics supporting cloud agents from all major platforms. Through cloud connectivity, engineers can incorporate visualisation of historic data with data analytics, remote sensor management, Alexa voice command support, alert notifications, cloud-based actuator control and more into their projects.

It is supported by Dialog’s software suite, which includes application software running on the DA14585, cloud gateway software for Raspberry Pi hardware, web applications and mobile applications for Android and iOS. Sensor data collected by the onboard DA14585 can be processed locally by Dialog’s SmartFusion software to enable data transmission with minimal interference and low power consumption prior to transmission to a smartphone or Bluetooth-enabled Raspberry Pi gateway to the cloud.