Thermal management — the key to extending device lifetime
Supplied by Electrolube on Thursday, 02 June, 2016
Electronic components often generate significant amounts of heat while in use. Failure to effectively dissipate this heat away from the device can lead to reliability concerns and reduce operational lifetimes.
Download this white paper to learn how to select and apply thermal materials on your design to effectively dispel heat and optimise your device.
Related White Papers
Comparing the incomparable: understanding and comparing IGBT module datasheets
This white paper explains the component parameters of IGBT modules, points out possible...
Your complete guide to building a test system
Ensure that you have the fundamentals to build a smarter test system that can address your needs...
Hard switching solution for moderate to high switching environments
New compact solutions for device packaging, silicon integration and MOSFET technology work...
