Thermal management — the key to extending device lifetime

Supplied by Electrolube on Thursday, 02 June, 2016


Electronic components often generate significant amounts of heat while in use. Failure to effectively dissipate this heat away from the device can lead to reliability concerns and reduce operational lifetimes.

Download this white paper to learn how to select and apply thermal materials on your design to effectively dispel heat and optimise your device.


Related White Papers

DC-DC converter module tips to achieve up to ±1% regulation

Learn how to reach a regulation accuracy of ±1% at...

16-bit oscilloscopes can fulfil demand for high detail

The vertical resolution of an oscilloscope determines how accurately signals are displayed....

How to design rapid-start power applications that never fail

Learn how to design an isolated power system that can start up within 10 ms of application of...


  • All content Copyright © 2025 Westwick-Farrow Pty Ltd