Photoetch Industries radiofrequency shielding

Photoetch Industries uses the chemical milling process to manufacture RF and EMI shielding in long or short runs. Manufacturing tolerances can be as tight as 0.1 mm. Part numbers and lettering can be etched into one side for easy identification.

Available metals are nickel silver, brass or tin-plated copper, all of which solder well. Complex shapes can be made with any kind of internal perforations; the overall shape is limited by what can be made from the sheet. Subassemblies can be soldered together or fabricated in a press. Text can be screen printed.

The shields have a removable lid that has a set of dimples to engage in holes in the wall. The wall is soldered on the right-hand side and fastened to the circuit board. In both cases, folding is achieved by etching a fold line halfway through at exactly the right place; this creates a line of weakness that controls the position of the fold. Folding forces are very light.