Laird Technologies ReMovl board-level shielding product enhancement

Friday, 29 June, 2012 | Supplied by: Tekdis

The ReMovl board-level shielding product enhancement incorporates the ReCovr attachment mechanism applied to the pickup bridge of the board-level shield frame to allow easy, tool-less detachment of the bridge after the frame is soldered to the PCB.

Online: www.tekdis.com.au
Phone: 03 8669 1210

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