Dow DOWSIL TC-6015 Thermally Conductive Encapsulant

Dow has introduced the DOWSIL TC-6015 Thermally Conductive Encapsulant, a silicone-based product that provides thermal management for power electronics applications. The encapsulant addresses a major industry dilemma: how to effectively manage the thermal demands of inverters, high-power modules, electric vehicle (EV) chargers and energy storage systems as their power increases and their size decreases.

To enable the design and production of smaller form factors with increased power capabilities, the encapsulant delivers high flow for thin-wall moulding and low density for weight reduction. It features primerless self-adhesion that enables time savings and room-temperature curing that reduces energy requirements. Primerless adhesion is estimated to save 15 min/module, and to prevent human and environmental exposure to solvent-based primers.

The product also avoids filler settling and hard caking, despite its low viscosity. Dow solved the issue of filler sedimentation using rheology promoters, which eliminate the need to redisperse the material before application and risk problematic air entrapment.

The encapsulant was designed to provide power components with resistance to high-temperature aging, thermal shock aging and high-temperature/high-humidity aging. It also provides good flame retardancy, meeting the UL 94 V0 standard at 1.5 mm and achieving a relative thermal index (RTI) of 150°C. It is supplied in a two-part silicone formulation that cures at room temperature, or with optional heat acceleration, to form an elastomer.