Chase Humiseal UV20GEL staking and vibration protection UV gel

Chase’s Humiseal UV20GEL is a fast-curing, non-sag thixotropic paste, which cures to give a flexible urethane acrylate that bonds well to engineered plastics and metal-based substrates. In addition to the UV cure, the material has a secondary moisture cure mechanism to enable cure in areas shadowed from UV light.

The gel is designed for staking and vibration dampening applications but doubles as a high-performance adhesive for general printed circuit board bonding applications. Applications include PET/RPET clamshell bond, plastic bonding, mechanical shock protection, components staking and vibration protection.

The UV-fluorescing gel is suitable for substrates including polycarbonate, PET/RPET, PVC, various metals and PCB components. It is RoHS and REACH compliant.