Investigation into isolated failure mechanisms
Supplied by Semikron on Tuesday, 04 August, 2015
Considerable efforts have been made to predict the operational lifetime of classical IGBT power modules over the last few decades. Most of these investigations were based on end-of-life active power cycling tests. The analysis identified two dominant failure modes: solder fatigue and Al wire bond failure. However, the lifetime models derived from these accelerated tests could not discriminate between these failure modes. Recently, more reliable interconnection technologies were developed, and both failure modes can now be studied independently.
This white paper presents experimental results that show how the failure modes cannot be described within one common lifetime model.
How to design rapid-start power applications that never fail
Learn how to design an isolated power system that can start up within 10 ms of application of...
Eliminate intermediate energy storage in EV power architectures
Learn about the BCM converter’s function, operation and capabilities as compared to a...
Test engineering insights from aerospace and defence
You are evaluated on your ability to manage cost and risk, whether you’re working on your next...
