Investigation into isolated failure mechanisms
Supplied by Semikron on Tuesday, 04 August, 2015
Considerable efforts have been made to predict the operational lifetime of classical IGBT power modules over the last few decades. Most of these investigations were based on end-of-life active power cycling tests. The analysis identified two dominant failure modes: solder fatigue and Al wire bond failure. However, the lifetime models derived from these accelerated tests could not discriminate between these failure modes. Recently, more reliable interconnection technologies were developed, and both failure modes can now be studied independently.
This white paper presents experimental results that show how the failure modes cannot be described within one common lifetime model.
Your guide to the latest IGBT chip technology
Learn about how you can reduce your power losses and increase maximum output power and power...
Which is better to protect your PCB — coating or resin?
The design of the PCB, the housing and the anticipated end-use environment all play a major...
How to rapidly build cellular IoT applications
Learn how to rapidly evaluate emerging cellular technologies and develop embedded IoT devices.
