Investigation into isolated failure mechanisms

Supplied by Semikron on Tuesday, 04 August, 2015


Considerable efforts have been made to predict the operational lifetime of classical IGBT power modules over the last few decades. Most of these investigations were based on end-of-life active power cycling tests. The analysis identified two dominant failure modes: solder fatigue and Al wire bond failure. However, the lifetime models derived from these accelerated tests could not discriminate between these failure modes. Recently, more reliable interconnection technologies were developed, and both failure modes can now be studied independently.

This white paper presents experimental results that show how the failure modes cannot be described within one common lifetime model.


Related White Papers

Keep your LEDs running brighter and longer — made easy

Learn about key power trends in the high-power LED market.

Your definitive guide to EMC and power supply

Understand the basics of EMC and apply this knowledge to your power supply.


  • All content Copyright © 2025 Westwick-Farrow Pty Ltd