Vishay Intertechnology VS-40MT160P-P, VS-70MT160P-P and VS-100MT160P-P three-phase bridge power modules

Vishay Intertechnology has introduced a series of 45 to 100 A three-phase bridge power modules in the low-profile MTP PressFit package. Compared to devices incorporating solder contact technology, the VS-40MT160P-P, VS-70MT160P-P and VS-100MT160P-P are said to lower production costs for welding machines, UPS, switchmode power supplies and motor drives.

The solderless PressFit technology of the power modules allows for easy one-step PCB mounting to reduce assembly time while simplifying in-field maintenance. Offering direct mounting to heatsinks, the devices’ 17 mm profile maximises space savings while optimising electrical layouts for application-specific power supplies.

Providing long-term durability, the power modules’ PressFit package offers increased resistance to shock and vibration while eliminating issues such as cold spots, voids, splatter and cracks. The devices are not subject to solder fatigue, a common failure mechanism in power modules operating at high temperatures.

Optimised for AC/DC input rectification, the 45 A VS-40MT160P-P, 75 A VS-70MT160P-P and 100 A VS-100MT160P-P offer 3500 V_RMS insulation voltage, low forward voltage and low junction-to-case thermal resistance. Designed and qualified for industrial-level applications, the RoHS-compliant devices are UL-approved.