Power Circuit Package

STMicroelectronics has introduced a generation of chip-scale packages for power integrated circuits as well as six n-channel MOSFETs that take advantage of the new package to reduce size and weight while boosting thermal and electrical performance.

The PowerFLAT case, available in 6 x 5 mm and 5 x 5 mm outlines,adopts a micro-lead-frame design that, partly by replacing leads with terminal pads, introduces a new chip-packaging concept.

Power devices supplied in the PowerFLAT package will find wide acceptance in DC-DC converters and the battery management sections of portable equipment.

Of the two outlines unveiled, the 6 x 5 mm case is pin compatible with a standard SO-8 package, yet accommodates 118% more die area.

Both outlines feature an exposed back slug that connects the MOSFET die to the printed circuit board for good heat dissipation.

Taking advantage of the PowerFLAT packages are six n-channel MOSFETs. Offered in the 5 x 5 mm outline version are the STL22NF10, with a 100 V drain-source breakdown voltage.

The remaining family members are the STL30NF3LL, with a BVDSS of 30 V, the STL35NF10, with a 100 V BVDSS, and the STL35NF3LL, with a 30 V BVDSS.

All six MOSFETs use ST's second-generation STripFET technology, which yields transistors having a very low on-resistance and minimal gate charge.