Walcon’s Mill-Max 1 mm pitch headers and sockets

Walcom has added 1 mm pitch headers and sockets to its Mill-Max line of fine pitch connectors. These through-hole, single row sockets and headers save real estate for interconnect solutions. The 860-10-0XX-10-002000 header and 861-13-0XX-10-002000 socket (XX=2 to 50) join the 1.27, 1.778 and 2 mm pitch interconnect offerings.

These connectors are through-hole soldered to the PCB, providing support and durability for applications requiring multiple insertions and extractions. The 860 series header and 861 series socket have solder tail diameters of 0.38 mm and 0.36 mm respectively, which allow for smaller PCB holes and greater clearance between holes for routing circuitry. The insulator bodies have standoffs on the termination side of the connectors to aid with the flow of solder. The header and socket provide a mated height 5.08 mm for board stacking applications.

The 860 header and 861 socket in 2 to 50 positions are RoHS compliant. Sockets have gold-plated shells and contacts, and headers have gold-plated pins. Hard gold plating on both the 860 and 861 series provides optimum conductivity and wear resistance. Both connectors have high-temperature insulators suitable for RoHS soldering processes.

All Mill-Max pin headers and sockets feature high-speed screw machined pins and receptacles. Each 861 socket is a precision-stamped beryllium copper Mill-Max #04 contact clip. The pin acceptance range diameter is 0.2 to 0.33 mm and has a current rating of 2 A.