Satcam through-hole connection system

A method of achieving ‘plated-through’ holes without an electroplating system, permits quick and cost-effective conductivity of circuit board holes.

Three sizes of 0.8, 1.0 and 1.2 mm are available. A flat finish to both sides makes it SMT-friendly and being hollow (unlike pins) they are suitable for through-hole components. Pure copper is used for optimum conductivity.

Each kit contains tooling and sufficient bails for 250 holes, one size per pack, and additional packs of bail-bars are available, 10 strips of 25 bails = 250 holes, one size per pack.

The manual system applies a conductive coating to the walls of a circuit board hole while maintaining a flat surface on both sides of the board. After hand-setting, the holes are left with a solder-plated copper wall and a solder-filled barrel. If a through-hole is not required, top and bottom pads are just soldered.

Where a through-hole is necessary, the solder core is removed with a de-soldering tool or wick after soldering both sides.

Bail-bars consist of lengths of solder wire which have been electroplated with pure copper then over-plated with tin and scored at intervals of approximately 2 mm. Each bail-bar is divided into 25 bails.

An insertion tool is used to insert the end of the bail-bar into the hole. The bail-bar is snapped off to leave one bail in the hole.