Samtec Searay interconnect range

The latest additions to the Searay family of interconnects are a right angle design for perpendicular and high-speed micro backplane applications and a press-fit design that combines the flexibility and convenience of press-fit tails with superior signal integrity and mechanical performance.

Both designs use a 1.27 x 1.27 mm grid array to achieve maximum grounding and routing flexibility and feature the signal integrity-optimised Edge Rate contact system.

The terminals and sockets (SEAM-RA/SEAF-RA series) are optimised to reduce skew and impedance mismatch and have low insertion and extraction forces. Terminals and sockets are available in 4-, 6-, 8- or 10-row configurations, with up to 500 I/Os.

Right angle arrays mate with Searay surface mount (SEAM/SEAF series) and right angle (SEAM-RA/SEAF-RA) sockets and terminals and with Searay high density flex data links (SADL series) and high speed twinax cables (SEAC series).

Press-fit terminals (SEAMP series) are available in 4-, 6-, 8- or 10-row configurations, offering up to 500 I/Os. The terminals mate with a choice of Searay interfaces: surface mount sockets (SEAF series) in three standard stack heights, high density flex data links (SADL series) for cable-to-board applications or the new right angle sockets (SEAF-RA series) for multilayer PCB designs such as high-speed micro backplane applications.

Additional pin counts, plating options and guide posts, as well as the required application tooling, are also available.

The company has also introduced a 0.8 mm micro pitch version of its SEAM8/SEAF8 series, offering high-speed performance and the grounding and routing flexibility of the 1.27 mm pitch arrays, while requiring 50% of the board space.