Molex Nano-Pitch I/O interconnect system

The Molex Nano-Pitch I/O interconnect system benefits high-performance applications by delivering robust, small-form-factor, high-speed and multiprotocol interconnects suitable for both internal and external solutions.

The system features a continuous ground-signal-signal-ground pinout concept, which optimises it for high-speed applications and maximises the number of high-speed lanes within the lengths provided. It provides up to 12 Gbps per channel in SAS 3.0 and up to 16 GTps per channel in PCI Express.

The low-profile connector solution supports SAS-3/SAS-4 and PCIe Gen 3/Gen 4 interfaces. The 42-circuit, 0.50 mm-pitch, metal shell SMT connectors are available in both right-angle and vertical versions to fit a variety of placement options.

The system offers staggered and constant dual-row contact configuration, enabling engineers to add components without shutting down the system (known as hot pluggability). The connectors also provide optimal routing for high-speed trace connections while reducing the need for PCB real estate.

The interconnect system provides inventory and manufacturing assembly efficiencies in data centre and enterprise storage systems, storage racks, storage controllers and host bus adapter (HBA) servers, as well as telecom hubs, servers, switches and routers.