Metallising 3D interconnects

ProtoPlate is said to close the gap in prototyping for three-dimensional interconnect devices.

Using the LDS process, interconnect devices are made out of plastic components and a ProtoPaint LDS finish allows plastic 3D prototypes to be coated for laser direct structuring.

The LPKF Fusion3D laser systems then create the circuit structures, and the new ProtoPlate metallisation reduces processing time.

This now allows for prototyping three-dimensional interconnect devices in-house without the need of extensive chemical knowledge.

Working metallisation is done electroless and the basic ProtoPlate LDS package consists of a beaker, a magnetic mixer, a thermometer, a hood and an exhaust system.

The chemical consumables for copper plating are part of the LPKF ProtoPlate CU set.

The whole set is developed in cooperation with Enthone GmbH, Germany.