STMicroelectronics STHVUP32 ultrasound transmitter

STMicroelectronics has launched the STHVUP32, a 32-channel variant ultrasound transmitter with high output current for portable applications. The transmitter provides ±800mA aimed at portable systems that require extra drive capability for a coaxial cable-mounted probe. Joining the portfolio alongside the 64-channel STHVUP64, the new 32-channel version contains similar features to increase performance and integration in next-generation scanners for medical and industrial applications.

The ultrasound transmitter has 5-level output capability, in addition to 3-level output, which enhances flexibility to improve the picture quality. Its high output current allows driving the scanner’s piezoelectric transducer at high speed to enable multiple imaging modes. It also helps achieve minimum pulse duration of 5 ns for improved image detail. The transmitter supports continuous-wave (CW) and pulsed-wave (PW) operating modes to allow various types of analysis including cavities and liquid flow.

The digital beam steering enhances directional control by permitting greater precision than conventional analog steering using delay circuits. By integrating the beam-steering logic, the transmitter can be used without a companion chip such as an FPGA. This saves PCB space and routing complexity, as well as bypassing FPGA-design challenges.

The transmitter also has a self-biased driver architecture that saves connecting decoupling capacitors to the transmitter’s power-supply pins. This provides a smaller circuit footprint and lowers the bill of materials. The transmitter is housed in a small package, thereby helping designers create next-generation products in smaller form factors. Built-in protection includes noise blocking, thermal protection, under-voltage protection, and recirculating current protection. There is also a diagnostic register that allows directly reading the causes of interrupts to ease debugging.

The transmitter is built using ST’s BCD8s-SOI technology that supports analog (bipolar), digital (CMOS) and power (DMOS) circuits on the same die. It is in production now, in a 11.5 x 10.5 x 1.35 mm 168-ball FC-BGA168 package.