STMicroelectronics SPSB081 automotive power-management IC

STMicroelectronics’ SPSB081 automotive power-management IC includes a range of features including a main fixed-voltage low-dropout regulator (LDO), a secondary programmable LDO, four high-side drivers, a CAN FD transceiver and an optional LIN transceiver. The ICs provide multiple standby modes with very low quiescent current and programmable local or remote wake-up to help minimise power consumption.

The power sources and transceivers available on-chip help simplify the design of car-body controllers for a sunroof, seats, tailgate, doors and lighting modules. The controllers are also used in gateways, HVAC controllers, passive keyless entry systems, telematic control units and control panels.

The available variants include the SPSB081C3 and SPSB081C5, which contain a 3.3 or 5 V fixed LDO, respectively, with one CAN transceiver. The SPSB0813 and SPSB0815 contain the additional LIN transceiver. The secondary LDO, included in all variants, can be programmed through the IC’s SPI port to operate as an independent 3.3 or 5 V regulator, or to track the main LDO. The four high-side drivers can source up to 140 mA to power LEDs and sensors, with current monitoring and a 10-bit PWM timer for each channel.

Extensive built-in protection is provided, as well as a diagnostic output pin for fail-safe signalling. These features support use in applications that must meet functional safety requirements in accordance with ISO 26262, even if not designed as a safety hardware element. All outputs feature overcurrent protection and open-load fault indication. The primary (fixed) LDO features overvoltage protection and thermal protection circuity, while the secondary (programmable) LDO has overload, over-temperature, short-circuit and reverse-bias protection. Both have short-to-ground monitoring at start-up and continuous regulator-failure monitoring.

The SPSB081 family is AEC-Q100 qualified, specified from -40 to 150°C, and able to operate up to 175°C. All variants are in production and available in a thermally enhanced 5 x 5 x 1 mm QFN32L package.