NXP’s LPC43S67-A70CM Cloud Connectivity Kit enables the design engineer to build secure IoT applications with AES encryption, NFC, Wi-Fi and a host of sensing technologies, driven by powerful, multicore ARM processing capabilities.
The kit offers a high-performance, dual-core ARM Cortex processor along with IC-enabled security and add-on boards affording the designer a range of IoT features like NFC, AES128/192/256 encryption, Wi-Fi connectivity, ethernet, an accelerometer, a gyroscope, a temperature sensor and an LCD, making it a suitable platform for anyone experimenting with IoT or cloud-backed mobile applications.
Beyond the target hardware, which includes the LPCXpresso43S67 board with LPC43S67 dual-core (M4F and M0+) MCU and NXP A7001CM Secure Element, NTAG NDC plug-in card, LPC General Purpose Shield and IEEE 802.11b/g SD card, the kit is supported by NXP’s LPCXpresso IDE and ZentriOS — a complete connected product operating system available as a licensable software solution. The Zentri SDK can be easily combined with the rich editing and debugging capabilities of the LPCXpresso IDE by installation of a free plugin.
Debugging is simplified by LPCXpresso43S67’s onboard Link2 probe, which provides full source code debugging capability without the need for any additional hardware.
Phone: 02 9644 7722
Siemens PADS Pro Essentials electronic systems design software
The Siemans PADS Pro Essentials software features an enhanced design experience that lowers...
Siemens Xpedition Standard electronic systems design technology
The Siemens Xpedition Standard electronic systems design technology is suitable for growing teams...
Siemens Process Preparation Stencil Engineering Tool
The Siemens Process Preparation Stencil Engineering Tool is designed to provide first-time-right...
