Philips integrates passives for RF design
Royal Philips Electronics has launched a semiconductor passive integration technology that the company said will lower costs for handset manufacturers.
The aim of the technique is to reduce size and cost as well as improving high frequency signal performance by reducing parasitics usually associated with discrete passive components.
"We realised that one of the key challenges for improving RF performance lay in the high quality integration of passive RF components," said Paul van der Plas, general manager of the power amplifier business at Philips Semiconductors.
According to Philips, the technique offers a packing density at least three times higher than conventional surface mount discrete component designs. Future applications will see integration of switching functions, filtering and bias de-coupling.
"Our passive integration technology offers exciting possibilities for increased integration of RF solutions into a much smaller area than previously thought possible," van der Plas said.
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