Insulating materials for microelectronics
Tuesday, 15 October, 2002
Researchers from the Commerce Departments National Institute of Standards and Technology reported they have developed methods for characterising key structural features of porous films being eyed as insulators for the ultrathin metal wires that will connect millions of devices on future microprocessors and increase processor speed.
It will help semiconductor manufacturers and their materials suppliers.
Related News
Ultra-thin cooling solution for mobile devices
Scientists have developed an innovative cooling device — an ultra-thin loop heat pipe...
Scientists unveil flexible OLED panel with built-in speaker
Researchers have developed a smartphone-sized OLED display that can change its shape and act as a...
A multimodal light manipulator
A new interferometer could replace beam-splitting waveguides for fibre-optics.
