u-blox and Intel HSPA modules
Monday, 12 August, 2013
u-blox is collaborating with Intel Corporation to bring a small, cost-effective 3G-only HSPA module to the market.
Based on Intel’s XMM 6255 HSPA modem platform, the chipset will be packaged in a compact, low-cost module that maintains layout compatibility with u-blox’s SARA 2G and LISA 3G module series. u-blox’s 2G-3G-4G nested design philosophy allows product designers to offer tailored solutions to their target markets based on a single PCB design.
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