The TDK FS1406 µPOL DC-DC power modules integrate a matching MOSFET, inductor and driver in a single semiconductor embedded in a substrate (SESUB) package, reducing the device’s form factor by up to 50% when compared with modules using a side-by-side integrated circuit and inductor. The modules feature an on-chip pulse-width-modulation (PWM) controller, integrated MOSFETs and incorporated inductors and capacitors, resulting in a regulator with high power density of 1 W/mm3.
The plug-and-play devices are suitable for industrial applications that require high power density, including network communications, servers and storage. The modules also support imaging, radars, security and other machines for the medical industry. Offering 15 W of output power in a 3.3 x 3.3 x 1.5 mm package, the compact point-of-load modules support a range of high-performance applications, including machine learning, artificial intelligence, big data, 5G cells and the Internet of Things (IoT).
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